Issue link: https://resources.pcb.cadence.com/i/1180190
Migration Guide for Allegro Platform Products October 2019 33 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. 2 Core Allegro Platform Back-End Products This section describes the impact of changed functionality in the 17.4-2019 release on existing workflows, scripts, or designs for Allegro® PCB Editor and all the other Allegro back- end layout products – PCB SI, and Allegro® Package Designer+ (APD+) – unless otherwise noted. Single IC Packaging Tool ■ A new product, Allegro Package Designer+, replaces SiP Layout XL and APD-L. The tiered functionality in SIP Layout-XL has either been included with APD+, or moved to a new SiP Layout option (SIP226). ■ SIP230 Advanced WLP option and SIP231 RF Option have been renamed to Silicon Layout and RF Layout, respectively. ■ Specctra Routing Technology has moved from the base APD+ product to the SiP Layout option (SIP226). ■ The add layer feature in the APD+ Cross-section Editor has an updated use-model. The type of layer added to the cross-section is dependent on the location of the Right Mouse Button (RMB).