Issue link: https://resources.pcb.cadence.com/i/1180190
Migration Guide for Allegro Platform Products October 2019 113 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. 4 Allegro Platform Package Products The following items describe new and/or modified functionality that may impact your existing work flow behaviors, scripts, or designs. Changes described here apply to tiers of Cadence® Allegro® Package Designer+ (APD+), and Allegro® Package SI (unless otherwise noted). Note: See the Core Allegro chapter for 17.4 changes and other user interface and functional changes that may apply to these Allegro® products. Migrating to 17.2-2016 Die Stack Editor changes To enable two-sided components, the Die-stack Editor now displays all die stack members in one dialog window with additional fields. You might need to update scripts that access the Die Stack Editor for GUI changes. Select Placement or Material details to view different types of information about the listed component. For example, selecting placement displays information about height, front and back layers, X and Y coordinates, and rotation. Selecting Material details displays information about conductor and dielectric materials and their thickness. You can move, delete, or swap components by right-clicking on the RefDes column of a component. The pop-up menu items depend upon the component type selected. For example, selecting a spacer allows you to resize the component. You can use the new Cavity top layer field to create closed-top cavity. Via structures created using earlier releases All via structures created and defined in releases earlier than release 17.2-2016 are not supported or available with the changed via structure commands. Via structures created using earlier releases are only available during create fanout.