Migration Guide for Allegro Platform Products
Core Allegro Platform Back-End Products
October 2019 72 Product Version 17.4-2019
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■ Techfile import supports .tcf and .tcfx formats in 17.4.
■ Techfile supports hierarchical layer types (plane, conductor, and user-defined) in 17.4.
■ Techfile schema is located at /share/pcb/consmgr/
schemas folder.
Binaries
The following programs have been renamed and their location has changed to
/tools/bin from /
tools/pcb/bin
Single bin directory
■ All user-accessible binaries have moved to /tools/bin.You no longer
need to set PATH variables on Windows and Linux. This change eliminates the missing
or wrong dll error messages on Windows.
■ On Windows, the Switchrelease program is still required to support older releases and
allow resetting file associations. To run tools from Windows using cmd.exe or
PowerShell, the allegro_cmd.bat is provided.
■ To run pre-17.2 releases, maintain the PATH variable with Cadence entries.
Single back-end binary
■ All layout and packaging tools, PCB Editor and APD+ programs have been combined into
a single binary, allegro to simplify patching, and allow easier sharing of technologies.
■ All IC Packaging tools (APD+ and CDNSiP) are consolidated under APD+. On Windows,
you can access them from the Start menu.
■ The single binary takes on the appropriate flavor at invocation. Modes to prepare the
designs for SI in a different editor are still supported.
16.6 17.4
uprev allegro_uprev
uprev_overwrite allegro_uprev_overwrite
cshrc (Linux only) allegro_cshrc
profile (Linux only) allegro_profile
