Simple PCB Layout Design: Tips and Strategies | Cadence

October 8, 2024

Cadence PCB Solutions

Key Takeaways

Multiple power plane layers and controlled impedance routing for stable voltage and minimal interference.
Implement thermal vias and strategic component placement to manage heat and noise, enhancing device reliability.
Leverage auto-routing, real-time DRC feedback, and strategic via placement, and 'cluster placement' with OrCAD X.

*Simple PCB layout with ICs, capacitors, and resistors.Caption*

A Printed Circuit Board (PCB) is the central element of electronic devices, serving as a platform for mounting electronic components and electrical connections through conductive paths (traces), pads, and vias. A simple PCB layout design ensures the reliability, functionality, and longevity of the electronic device. OrCAD X, an intuitive yet powerful PCB design tool, offers a range of features that simplify and optimize the layout process, making it accessible for both novices and experienced designers.

Layout Aspect	Considerations and Strategies
Component Placement	Place components for the shortest possible trace lengths. Group related components together (e.g., all analog or all digital components). The 'cluster placement' feature in OrCAD X allows for this. Place high-frequency components away from sensitive areas.
Power Distribution	Design multiple power plane layers (or pours if compact) for low impedance impedance power distribution and stable voltage Use using thick traces or copper pours for high-current needs
Signal Routing	Route critical signals with minimal lengths and avoid crossing split planes. Maintain controlled impedance for high-speed signals and use differential pairs for high-speed data transmission.
Grounding	Create large ground pours (and planes), avoiding ground loops, which can lead to interference. Design a solid ground plane and use multiple vias on ground connections to reduce impedance.
Thermal Management	Use thermal vias to connect heat-generating components to a heat-sink layer and place thermally problematic components near cooling solutions.
Noise Management	Place high-speed components away from analog components. Place noisy components away from sensitive areas and use decoupling capacitors close to power pins of ICs to reduce noise.
Assembly and Testing	Consider ease of assembly and accessibility for testing, designing for manufacturability and testability (DFM/DFT. Include test points for critical signals and ensure components are not placed too close to board edges or in hard-to-reach places.

General Principles of PCB Layout

Design for Manufacturing (DFM) guidelines: Ensures design is practical and cost-effective to manufacture. Emphasizes component placement, trace routing, and avoiding unnecessary features.
Design for Testing (DFT): Focuses on designing PCBs to make them easy to test for defects, incorporating test points and diagnostic features such as boundary scan (JTAG), built-in self test (BIST), and probe pads.
Signal integrity and layout considerations: Involves arranging traces, ground planes, and components to minimize interference.
Thermal management practices: involves effective heat dissipation through the strategic placement of thermal vias and heat sinks as needed.

Simple PCB Layout Design Workflow With OrCAD X

With OrCAD X, you can ensure simple pcb layout design by customizing toolbars, panels, and design. OrCAD X also allows you to save workspace configurations, ensuring that your design environment is tailored to your workflow.

You can organize electronic components with libraries and advanced search features, allowing quick retrieval and accurate placement of components.

OrCAD X Features For Simplifying PCB Design

OrCAD X Feature	Key Points
Auto-router	Speeds up routing for standard sections. Automatically selects appropriate vias based on design constraints.
Design Rule Check (DRC)	Continuously monitors design for rule violations. Helps avoid common errors and ensure compliance with design rules. Real-time DRC feedback for immediate error detection and resolution.
Placement Features	Utilizes alignment guides and design for assembly (DFA) rules for optimal component placement. Ensures manufacturability and performance. Includes Design for Assembly (DFA) package-to-package spacing rules.
Layer Management	The Cross-Section Editor provides tools for managing multiple layers.. Includes setting layer types, thicknesses, and material properties in the Cross-Section Editor. Supports rigid-flex designs with specific layer stack-ups and bend areas.
Strategic Via Placement	Allows for via arrays creation, minimizing inductance and resistance. Allows for easy addition of blind, buried, and micro vias.
Avoiding Common Pitfalls	Ensures adequate spacing between components with constraint manager. Users can receive real-time DRC feedback through the Constraint Manager to set and manage design rules effectively.

Simple PCB layout design is important for reliable electronic devices. With Cadence's suite of tools, especially OrCAD X, designers can effortlessly manage component placement, signal routing, power distribution, and thermal management. To explore how Cadence tools can revolutionize your PCB design workflow, visit our PCB Design and Analysis Software page and discover the full potential of OrCAD X.

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