Blogs

Integrated Signal and Power Integrity Analysis FAQs

The Pros and Cons of Being a PCB Designer

An overview of the best and worst things about a career in PCB Design

CoDesign and Outsourcing PCB Design

Learn how teamwork and outsourcing solved complex HDI PCB design challenges. Real-world case study on managing vendors and compressed timelines.

Regarding WiFi and Bluetooth Devices

WiFi standards are continuously improving to meet the demands of our mobile devices.

Concerning Thermal Challenges With Printed Circuit Boards

Tips for managing heat dissipation on a printed circuit board assembly.

Grounding and Return Paths: Power Plane No-Nos

Learn to avoid PCB grounding mistakes that harm signal integrity and EMI. Master return paths, power planes, and best practices with Cadence Allegro X for optimal design.

PCB Design Testability: A Practical Guide for Beginners

Learn PCB design for testability (DFT) to reduce defects, simplify manufacturing, and ensure easy validation. Discover essential testing methods and techniques perfect for beginners.

Navigating Signal Integrity Challenges in High-Speed PCB Design: Practical Tips to Solve Common Obstacles

Tackle signal integrity issues in PCB design with expert tips on SI challenges like impedance & ground planes using Cadence tools.

How to Leverage PSpice For Pre-Layout Simulation FAQs

Power Circuits: An Island POV on PCB Design

Power distribution networks have a similarity to nature in that energy flows somewhat like water.

Comparing Connectors and Cables to Flex Circuits

Good connector placement completes a PCBA design as the goals align with the board and the outside world.

How to Do Transient Analysis in PSPICE

How to do transient analysis in PSpice and simulate time-domain circuit behavior using OrCAD X. Learn setup, key settings, and waveform interpretation.

What I’ve Learned About Impedance, Decoupling, and Planes That Changed My Approach

Discover how to design circuit boards with reliable power delivery. Learn key principles like impedance control, decoupling strategies, and power plane optimization for high-speed systems.

Grounding and Return Paths: Advanced Techniques - Part Two

Explore grounding techniques in high-speed PCB design to ensure signal integrity, reduce EMI, and optimize DDR, USB, PCIe, and RF system performance through smart design strategies.

Grounding and Return Paths: Essential for High-Speed Designs - Part 1

Discover how grounding strategies impact signal integrity, EMI/EMC, and power delivery in high-speed PCB design. Avoid failure with expert-backed tips.

Advanced PSpice Features for Circuit Analysis with OrCAD X

Discover how advanced PSpice features for circuit analysis in OrCAD X solve real-world performance, yield, and reliability challenges.

Discussion of the MOSFET Simulation Model: Theory to Reality

Build accurate MOSFET simulation models with PSpice to evaluate static, dynamic, and environmental behavior. Learn key parameters and simulation tips.

PCB Substrates Part 2: A Performance-Driven Approach to Reliability in 2025

Discover key performance factors that guide PCB material choices, including signal integrity, heat resistance, and durability.

PCB Substrates Part 1: The Truth About Cost vs Performance in 2025

Discover how PCB substrate materials like FR4, Rogers, and ceramics impact signal integrity, thermal performance, and long-term reliability.