Why SI and PI Must Be Solved Together During PCB Layout
Reference planes ensure signal & power integrity. Vias carry signal & power currents. Dielectrics impact both. Fixing one issue in isolation can break another.
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Stay connected with the latest news, developments, and tips in electronic design
Reference planes ensure signal & power integrity. Vias carry signal & power currents. Dielectrics impact both. Fixing one issue in isolation can break another.
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Allegro X
Design Platform
Crosstalk is predictable from geometry. Discover how spacing, length, and reference planes affect crosstalk, and how to measure near/far-end crosstalk during routing in Sigrity X Aurora.
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Your voltage regulator outputs clean power, but the IC has noise. The issue lies in the copper. Discover how plane spacing, cavity resonance, and via placement shape power delivery.
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Your PCB passes design rule checks but fails signal integrity at 8 Gbps. Discover three failure modes geometric rules miss and how electrical analysis prevents them pre-fabrication.
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Explore PCB design for signal integrity with insights into transmission lines, PDN requirements and impedance control versus manufacturing concerns.
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3D PCB Design and Analysis: ECAD/MCAD and Where They Converge
ACCESS EBOOKAn overview of PDN design for PCBs, covering linear and switch mode power supplies plus placement and connectivity considerations for power integrity.
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RF Design: The Wave of the Future
ACCESS EBOOKLearn how ICT and flying probe testing work in PCB assembly production, including test fixtures, SPC, burn-in, and design for testability tips.
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Optimize your PCB design for assembly with tips on component placement, double-sided boards, RoHS compliance, and creating efficient, error-free manufacturing processes
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Printed Circuit Board testing ensures reliable connections and functionality. Learn about continuity checks, evaluation boards, and DFx considerations for effective product placement.
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PDN: Gives Your Board Life
ACCESS EBOOKVia stubs are a hidden threat to signal integrity. Learn the physics of quarter-wave resonance and how backdrilling or blind vias prevent destructive signal interference in your high-speed PCB design
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Achieving PCI-e Compliance: Getting it Right the First Time
ACCESS EBOOKDiscover how eye diagrams go beyond compliance testing to reveal signal integrity issues, timing margins, and design flaws, ensuring reliable high-speed communication in PCB systems.
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Explore the challenges of PCB design for software-defined vehicles, from high-speed Ethernet to signal integrity, and learn how to ensure safety and reliability in evolving automotive architectures.
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Lost in Transmission: Solving Common Issues in High-Speed Design
ACCESS EBOOKDiscover why PCB routing topology, like layer transitions, vias, and return path quality, matters more for Signal Integrity success than raw data speed.
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Learn the physics behind PDN failures and why high-frequency noise is controlled by mounting inductance, not just capacitance. Discover the key to lower loop impedance.
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FLEXing Like a PCB Expert
ACCESS EBOOKExplore PCB design for signal integrity with insights on digital transmission lines, differential pairs, impedance control, and phase matching for high-speed circuits.
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Learn how PCB button plating works in flexible circuits, how it impacts impedance control and copper thicknesses, and how to clearly define plating intent for your PCB manufacturer.
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Exploring the points in the fabrication and assembly processes where electrical testing is warranted.
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Common Sources of BOM Rejection and How to Prevent Them
ACCESS EBOOKThere are infinite ways to create a power distribution network. Some are better than others. Make yours better.
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10 Common DFM Issues and How to Fix Them
ACCESS EBOOKDiscover why decoupling capacitor placement becomes a critical challenge in HDI PCB designs. Learn how to overcome constraints like fine-pitch BGAs, stacked microvias, and PDN complexities for optimal
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Your Route to Design Success
ACCESS EBOOKUnderstand HDI PCB design by tackling resin flow, glass weave, and dielectric behavior. Prevent defects like voids, skew, and delamination in high-density stackups
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