The GAAFET Fabrication Process
Learn more about the GAAFET fabrication process and how it compares to FinFET fabrication here.
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Learn more about the GAAFET fabrication process and how it compares to FinFET fabrication here.
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Understand the factors influencing the epitaxy (epi) process in semiconductor fabrication here.
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Learn about the main kinds of dipole antenna polarization and how each type of polarization is achieved —linear, elliptical, and circular.
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Explore how PCB antenna design software is reshaping compact wireless device design and manufacturing, offering solutions for high-performance antennas.
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Learn how impedance matching for USB interfaces is related to single-ended and differential characteristic impedance.
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Learn how to perform the IC continuity test using a multimeter.
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Explore the crystal oscillator frequency range and its specific applications in electronics, from timekeeping to advanced communication systems.
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Serial communication protocols define how data is transmitted sequentially between devices over a communication link based on standardized rules.
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Learn how active biasing in RF amplifiers helps to achieve either high output power or good harmonic performance.
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A gate driver for a MOSFET needs to turn on the gate as fast as possible. Despite the rise time specification in
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EMC in a system with a battery should be carefully navigated. Make sure your grounding strategy includes appropriate use of the negative battery terminal.
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Magnetostriction occurs in all magnetic materials, sometimes you just don't notice. Here are some ways to reduce buzzing from magnetostriction.
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The most power hungry data center architecture is requiring kA levels of current sourced directly on the PCB.
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PDN impedance carries unique effects on each portion of a PCB’s power delivery capability. Learn more about PDN impedance elements in this article.
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Many EMI myths in PCB design can be found online, but we will help you cut through the myths and better understand their context.
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New semiconductor fabrication capacity is increasing at a shocking rate, here’s where that new capacity is coming online and what production volumes you can expect.
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High power output isolation, and compact form factor I'll come together in DC/DC converter modules.
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MOSFETs used for switching can be quite different from MOSFETs used for high power. Sometimes, MOSFETs need to do both.
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Simple formulas can be used to find MOSFET losses in a switching regulator.
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Discrete semiconductors can have very high failure temperatures. If you see components desoldering themselves, here's what you can do.
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