Keyed Flex Cables Help Prevent Assembly Errors
Assembly errors can occur whenever a keyed flex cable and connector is rotated and reverses its pinouts. Keyed flex cables help prevent this problem.
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How to Select and Size a Switching Power MOSFET
Power MOSFETs can be used in switching circuits if their continuous current and peak current meet specification.
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How to Design a PCB With a Serial Port Interface
Serial terminal interfaces on a PCB give users the ability to control their device over a programming module or USB port.
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Flexible PCBs: Ductility in Circuitry
Flexible PCB designs can perform where rigid boards would be impractical or impossible, providing excellent mechanical resistance in a compact form.
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Standard PCB Board Thickness: A Brief History
Standard PCB board thickness is a remnant of the materials used to fabricate the earliest etched circuits, but they remain prominent today.
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Design for Test in Embedded Development
Serial interfaces, test-points, and software-driven testing can make embedded systems testing much easier for developers.
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Why FOWLP Routing is Used in Advanced Packages
Advanced packages with multiple chiplets in FOWLP require so much routing that it has become a bottleneck.
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IC Supervisors: Do You Need Them in a PCB?
IC supervisors provide voltage monitoring and stable transitions between voltage states.
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Voltage Divider With Complex Impedance
What happens when you have a voltage divider with some complex impedance? Here’s how to simulate these circuits.
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How a PCB Manufacturer Verifies Controlled Impedance
Controlled impedance in a high-speed PCB stackup is calculated and verified with a TDR measurement.
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Which Chip Packages Are Used in Different Applications?
Systems designers building ASIC chip packages will find that different packaging styles are quite popular in different applications.
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Pin-in-Paste Soldering for Through-Hole Pins
An alternative to wave soldering is pin-in-paste soldering for through-hole parts. Here’s how it works
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Thin-Film Application Methods: Vapor Deposition vs. Sputtering
Compare vapor deposition vs. sputtering for thin-film application.
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Antenna-in-Package (AiP) Technology
Discover the impact of Antenna-in-Package (AiP) technology on wireless connectivity and its advantages in compact device design.
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Fan-Out Packaging
Explore fan-out packaging: its role in device miniaturization, performance advantages, challenges, and future advancements.
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Microwave Amplifier Design Overview
Critical aspects of microwave amplifier design and strategies for broadband performance
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PCB Resistors and Board Design
PCB resistors are crucial to board design and functionality; they control current flow, divide voltage, and set specific circuit parameters.
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Power Combining in PCB Design
Power combining techniques are applied in PCB design, especially in RF and microwave applications, where combining signals or amplifying power is needed.
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Optimizing PLM Software Selection and Integration
The best PLM software selection emphasizes effective data management, efficient design integration and usability in a single package.
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Pulse Code Modulation: Steps for Signal Integrity
Pulse code modulation is at the heart of many standard conversion techniques; maximizing signal quality requires designers to understand its ins and outs.
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