PCB Cross-Section Analysis and OrCAD X

Step

Description

Step 1: Cut and Mount a Section

• A section of the PCB measuring around one square inch is cut out and mounted into potting material. 

• The potting material hardens around the PCB cutout and provides support and protection to the sample from the subsequent processes of polishing and etching.

Step 2: Polish or Etch and Optical Microscopy

• The sample is polished until the target plane is reached. The PCB specimen is then examined under an optical microscope. 

• The optical microscope helps show the microstructure of the PCB cross-section. Instead of polishing, the PCB specimen can be etched before viewing it under the optical microscope.

Step 3: Use a Scanning Electron Microscope

The scanning electron microscope helps examine the PCB specimen surface or cross-section. Neither polishing nor etching is required before microscopy for scanning electron microscopy (SEM) examination. Various modes of SEM are used to gather different information.

• Secondary electron mode: Topographic information of the sample surface

• Back-scattered electron mode: Topographic information and elemental contrast of the sample

• Energy dispersive spectroscopy: Direct qualitative and semi-quantitative elemental analysis on localized areas in the PCB specimen

Standard

Description

IPC-TM-650

Provides a complete testing manual for PCBs, specifying procedures for electrical testing, inspection, environmental testing, and verification of electronic assemblies. It ensures consistent and repeatable performances for all PCBs in electronic products. Also includes inspection, environmental testing, and required equipment.

IPC-TM-650 2.1

Describes guidelines for PCB cross-section analysis, evaluating internal structure and quality. It includes quality checks based on the thickness and distribution of coating and metallization, as well as solder joints and interconnects, to identify process deviations.

OrCAD X Tool

Description

HDI (High-Density Interconnect) and Via Arrays

Helps create compact designs by using blind, buried, or micro vias, enabling more parts per board area and more routes per layer. Provides a versatile tool to add vias in various patterns and configurations, significantly enhancing design flexibility and efficiency.

Cross-Section Editing

Allows setting up the stack-up for the PCB, including layer thickness, material, and surface finish. This helps ensure the design meets signal integrity and cost constraints.

3D Engine

Improves visualization of rigid/rigid-flex designs and includes MCAD-ECAD integration for better manufacturability.

Constraint Management

Provides real-time constraint-driven feedback, ensuring a manufacturable and functional PCB.

Design for Manufacturing (DFM)

Offers a suite of powerful DFM checks to ensure fabrication and production reliability, including design for fabrication, assembly, and test constraints.

Design for Assembly (DFA)

Enables setting up specific rules for component spacing and placement, ensuring that components can be efficiently assembled using automated or manual processes.

Signal Integrity Analysis

Provides tools for impedance and coupling analysis, allowing designers to identify and resolve signal integrity issues.