Issue link: https://resources.pcb.cadence.com/i/1180282
High Density Interconnect Working with HDI October 2019 10 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. Blind and Buried Via Span Labels Via span labels graphically identify the beginning and ending layers of a single via or a series of stacked vias using numerals within the pad extents. A colon between the beginning and ending layers indicates the span of a single blind and buried via; a dash represents a stacked series of blind and buried vias. Enable via span labels using the Display tab of the Design Parameter Editor, available by choosing Setup – Design Parameters (prmed command). The label's color defaults to white, but is customizable through the Display tab of the Color dialog box, available by choosing Display – Color/Visibility (color192 command). Layer numbers ascend in numerical sequence; for example, Layer Top = 1, Inner Layer 1 = 2, Plane 1 = 3, etcetera. The mapping between the display and actual layer names is not user configurable. Labels do not appear on through-hole vias or pins. For more information, see the Color dialog box in the Allegro PCB and Package Command Reference. Figure 1-3 Via Span Labels on Single (l) and Stacked Vias (r) Via List Enhancements The Via List, an object in the Physical Constraint Set, supports bitmaps and Start/End layer fields to identify the via type and its range. The list represents a selectable order of vias when used with Route – Add Connect (add connect command). For more information, see the Edit Via List in the Allegro Constraint Manager Reference.