Issue link: https://resources.pcb.cadence.com/i/1180282
High Density Interconnect Working with HDI October 2019 25 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. Figure 1-13 Drill-based Checks Constraint Manager Integration Hole to metal-based constraints can be driven from Spacing CSets or directly set on Net- based objects in Constraint Manager. Both the Spacing and Same Net Spacing domains support a suite of Hole to (Line, Pin, Via, Shape and Hole) spacing checks. On new boards, hole-based constraints default to 8 mils; all other spacing constraints default to 5 mils. On uprev'd boards, hole-based constraints are derived from the Spacing CSets to ensure metal- to-hole spacing aligns with net-spacing rules. A hole-to-metal DRC occurs when the hole is seen as the outer extent of the pin/via element. If a pad is present and larger than the hole, the spacing DRC heck geometry against the pad extents. Both a hole and a pin/via pad violation cannot occur on the same element. Dynamic Filleting The gloss-based fillet application updates fillets dynamically on pins, vias, or T-junctions. The application continues to support interactive or batch mode as well as existing parameters. The Dynamic Fillets option on the Pad and T Connection Fillet dialog box offers the convenience of filleting during interactive etch editing with no additional procedures. When this option is enabled, fillets are added when a connection is made to an element or deleted when removed. Shape-based Fill The fill associated with fillets has transitioned from line to shape-based. A single entity fillet is managed more efficiently in the database. For DRC considerations, the fillet should be regarded as an extension of the pin or via.