Issue link: https://resources.pcb.cadence.com/i/1180282
High Density Interconnect Working with HDI October 2019 23 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. Figure 1-12 Allow Suppression of Unconnected Internal Pads Option Dynamic Suppression Pad suppression becomes dynamic once the Dynamic Unused Pad Suppression option is enabled, and the dialog box closes. Suppression or restoration occurs on the fly. Upon closing the form, all eligible pads are suppressed. Pads are restored as connections are made to pins or vias. In contrast, pads are dynamically suppressed if traces are deleted from pins or vias. Disabling the dynamic option restores all pads on pins and vias. DRCs may result if traces become closer to the drill hole. The pad definition remains unchanged as a result of suppression. Exception Properties The UNUSED_PADS_IGNORE property prevents pad suppression at the symbol, net, pin, or via level. Once applied, pads remain static on the respective elements. The UNUSED_PADS_OVERRIDE property allows pads to be removed on outer layers. The property is restricted to a symbol with values of Top, Bottom, or Top:Bottom. Consider using on edge connectors to minimize the amount of gold used during plating. Artwork Alignment When Dynamic Unused Pads Suppression is enabled, the legacy film control Suppress Unconnected Pads option and functionality appears enabled for all films, but grayed out and non-editable: Database-driven suppression occurs. If dynamic suppression is not enabled; however, the checkboxes are individually editable as needed, and legacy suppression occurs instead. Legacy suppression handles blind and buried vias where the begin and end layer pads must never be suppressed, even if unconnected and on an internal layer.