OrCAD X Resources

Notice how we can use different constraint sets for different areas and stackups of the PCB as well. We have some flex regions on the board, so we would have custom values for our various regions. See the image below for an example. Likewise for Flex Stiffener and LCD Stiffener areas. Next are the components, which fall under assembly. 68 www.cadence.com OrCAD X Constraint Management Guide

• Cover
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• Part 5 – Project Example in OrCAD X
• Hardware Design Project
• Modern Hardware Design Process
• Organize the Nets
• Define Net Classes
• Define Net Groups
• Decide On Constraint Regions
• Setting Spacing Regions
• Schematic Constraints Overview
• Electrical Constraints
• Physical Constraints
• Physical Constraint Set
• Applied Constraint Set
• Spacing Constraints
• Spacing Constraint Set
• Electrical Properties
• PCB Constraints Overview
• PCB Stack up
• Opening The Constraint Manager (PCB Side)
• All Constraints for Analysis
• Applying Standard PCB Constraints
• Trace Width
• Differential Pairs
• Physical Region
• Applying High-Speed and Advanced Constraints
• Advanced Constraints Application
•  Advanced Electrical Constraints
• Wiring topology
• Stub Length (Max Stub Length)
• Maximum Exposed Length
• Maximum parallel trace length
• Layer restrictions
• Maximum via count
• Characteristic impedance
• Propagation delay modeling
• Total etch length limits
• Differential pair rules
• Relative signal velocity
• Return path management
•  Advanced Physical Constraints
• Trace Width
• Differential Pair Advanced Physical Constraints
•  Advanced Spacing Constraints
• Class-to-Class Spacing for Differential Pairs to Differential Pairs Spacing
• Constraint Region
•  Advanced Same Net Spacing Constraints
•  Advanced Manufacturing Constraints
• Design for Fabrication Constraints
• Design for Assembly Constraints
• Design for Test Constraints
•  Advanced 3D Constraints
• Component to Component
• Component to Board
• Component to Rigid-Flex
• Component to Board Edge
•  Advanced Properties
• Electrical Properties
• General Properties
• Route/Vias Keepout Exception
• Component Properties – General
• Component Properties – Thermal
• Component Properties – Swapping
• Component Properties – Reuse
• Pin Properties – General
• Pin Properties – Shapes
• Pin Properties – Manufacturing
•  Advanced DRCs
• Constraint Analysis
• Final Constraint Design Rule Check
• Board Simulation (Impedance and Crosstalk Analysis Using Sigrity X Aurora)
• Impedance Workflow
• Coupling Analysis for Crosstalk
• Conclusion of Part 5 - Project Example
• Conclusion - Next Steps
• Appendix