Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform
Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.
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Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.
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Allegro Package Designer Plus
Learn MoreA comprehensive study on a signoff quality physical design of a 3D high-performance microprocessor, Neoverse N1 CPU, using face-to-face (F2F)
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The Cadence® Integrity™ 3D-IC Platform is the new high-capacity, unified design and analysis platform for designing multiple chiplets.
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Clarity 3D Workbench is a part of the Cadence Clarity 3D Solver solution that is designed for electromagnetic and power electronics analysis and simulation.
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Today’s modern electronic designs require more functionality and performance than ever to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.
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We can think of packaging-based 3D as "backend 3D" and advanced integration as "frontend 3D". Learn more in this article!
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Cadence's expert on advanced packaging, John Park, gives a webinar on 3D IC Packaging.
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This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact...
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Overview of trends for foundry-based 2.5D-IC, 3D-IC, and FOWLP packaging, including the benefits of a modernized design flow.
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The Cadence® EMX® Planar 3D Solver is an electromagnetic simulator for high-frequency, RF, and mixed-signal integrated circuits. It allows designers to accurately and efficiently simulate large...
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Cadence® OrbitIO™ interconnect designer revolutionizes the cross-substrate interconnect architecting, assessment, implementation, and optimization process by unifying IC, package, and PCB data...
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Chin-Chi Teng, GM and SVP gives an overview of Cadence’s latest unified platform offering in the 3D-IC design and analysis space.
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Provides an industry-first holistic and comprehensive 3D-IC design planning, implementation, and analysis platform.
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Learn how the Cadence design platforms address the growing problem of increased electromagnetic (EM) coupling and electrothermal concerns in densely packed electronics by providing seamlessly...
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Recently Cadence's John Park presented a webinar on Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging.
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Integrity 3D IC Platform
Learn MoreAccompany by 5G development, RF module design will meet more challenges in linearity, power, and heat necessary to be successful in the handset market.
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RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with...
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In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner...
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Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro®...
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Don Chan, VP of Research and Development for Foundry and 3D-IC, gives a breakdown of the key pieces of the Integrity 3D-IC platform targeted towards solving the challenges of a 3D-IC design system.
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