eBook: 3D Packaging vs 3D Integration
In this eBook we explore the background of multi-chip packaging, delve into the trends of heterogeneous integration and multi-die packages, and address design and analysis challenges.
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IC Packaging
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3D-IC Design Challenges and Requirements
3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing.
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What is a Multi-Die Chip?
Learn about multi-die chip design and discover its benefits, applications, and the revolution it has brought to the semiconductor industry.
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Gallium Nitride vs. Silicon
Learn the difference between the use of gallium nitride vs. silicon in semiconductor technology.
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IC Package Design and Analysis
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MCM Packaging
Optimize your MCM packaging design for power efficiency, reliability, and streamlined functionality. Explore the latest advancements in MCM packaging.
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Wafer Level Chip Scale Packaging: What Is That?
Wafer level packaging incorporates wafer fabrication, test, and burn-in for full wafer production.
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Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis
Read about market demand for new heterogenous, chiplet-based architectures and the system-level design methodologies required.
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John Park's Webinar on Chiplets
Recently Cadence's John Park presented a webinar on Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging.
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2.5D vs. 3D Packaging
Compare 2.5D vs. 3D semiconductor packaging technologies, including advantages, applications, and future prospects.
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Wafer Thinning Benefits
Explore wafer thinning in semiconductor production, including the key methods, benefits, and challenges in creating ultra-thin, high-performance chips.
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Ball Grid Array Technology Overview
Discover ball grid array (BGA) technology and its advantages in high-speed performance, pin density, and heat conduction.
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The Evolution of IC Packaging
Explore the evolution of IC packaging, from the invention of the first semiconductor package to modern trends in heterogeneous integration.
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Tips for IC Package Thermal Simulation
Explore key strategies for effective IC package thermal simulation to ensure optimal heat management in semiconductor devices.
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Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact...
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Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform
Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.
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A New Platform for 3D-IC Design and Analysis in Cadence’s 3D-IC Leadership
Chin-Chi Teng, GM and SVP gives an overview of Cadence’s latest unified platform offering in the 3D-IC design and analysis space.
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3D-IC Design Solutions
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Key Components in a System-in-Package (SiP)
Here are the main system-in-package components designers need to include for a new ASIC or specialized processor.
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Signoff STA for Multi-Chiplet Design
Michael Jackson, Corporate VP of Research and Development for Signoff Technology, explains the powerful RAID technology in the Tempus Signoff Solution to help address signoff complexities...
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System-Driven PPA for Multi-Chiplet Designs
This white paper discusses the need, challenges, and solutions for 3D-IC design and analysis achieved with the Cadence® Integrity™ 3D-IC platform—the industry’s first integrated solution for...
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Why FOWLP Routing is Used in Advanced Packages
Advanced packages with multiple chiplets in FOWLP require so much routing that it has become a bottleneck.
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