Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform
Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.
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IC Packaging
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Allegro Package Designer Plus
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Taking Arm Neoverse into 3D with Digital Full Flow
A comprehensive study on a signoff quality physical design of a 3D high-performance microprocessor, Neoverse N1 CPU, using face-to-face (F2F)
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Introducing the Integrity 3D-IC Platform for Multi-Chiplet Design
The Cadence® Integrity™ 3D-IC Platform is the new high-capacity, unified design and analysis platform for designing multiple chiplets.
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System Analysis Knowledge Bytes: A Quick Overview of Clarity 3D Workbench
Clarity 3D Workbench is a part of the Cadence Clarity 3D Solver solution that is designed for electromagnetic and power electronics analysis and simulation.
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Successful Thermal Management of 3D-ICs: Accurate, Fast, Efficient and Scalable with Celsius
Today’s modern electronic designs require more functionality and performance than ever to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging.
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3D Packaging Versus 3D Integration
We can think of packaging-based 3D as "backend 3D" and advanced integration as "frontend 3D". Learn more in this article!
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John Park Webinar: Is It the Age of the Chiplet?
Cadence's expert on advanced packaging, John Park, gives a webinar on 3D IC Packaging.
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Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact...
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An EDA perspective
Overview of trends for foundry-based 2.5D-IC, 3D-IC, and FOWLP packaging, including the benefits of a modernized design flow.
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EMX Planar 3D Solver
The Cadence® EMX® Planar 3D Solver is an electromagnetic simulator for high-frequency, RF, and mixed-signal integrated circuits. It allows designers to accurately and efficiently simulate large...
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OrbitIO Interconnect Designer
Cadence® OrbitIO™ interconnect designer revolutionizes the cross-substrate interconnect architecting, assessment, implementation, and optimization process by unifying IC, package, and PCB data...
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A New Platform for 3D-IC Design and Analysis in Cadence’s 3D-IC Leadership
Chin-Chi Teng, GM and SVP gives an overview of Cadence’s latest unified platform offering in the 3D-IC design and analysis space.
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Integrity 3D-IC Platform
Provides an industry-first holistic and comprehensive 3D-IC design planning, implementation, and analysis platform.
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Advances in EM Analysis and Design Flows for RF System Development
Learn how the Cadence design platforms address the growing problem of increased electromagnetic (EM) coupling and electrothermal concerns in densely packed electronics by providing seamlessly...
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John Park's Webinar on Chiplets
Recently Cadence's John Park presented a webinar on Design Methodologies for Next-Generation Advanced Multi-Chip(let) Packaging.
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Integrity 3D IC Platform
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Efficient and Accurate RF/3DIC Model Extraction Solution with EMX (Chinese)
Accompany by 5G development, RF module design will meet more challenges in linearity, power, and heat necessary to be successful in the handset market.
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mmWave Chip, Package, and Board Beamforming Solutions
RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization are taking place with...
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Intelligently Managing 3D-IC Timing Signoff
In this white paper, we will present the Cadence® Tempus™ Timing Signoff Solution’s innovative approach to 3D-IC signoff which provides signoff quality results while intelligently managing corner...
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Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, PCBs, and Packages
Cross-domain co-design and co-analysis capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro®...
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Delivering System-Driven PPA with a Unified Environment
Don Chan, VP of Research and Development for Foundry and 3D-IC, gives a breakdown of the key pieces of the Integrity 3D-IC platform targeted towards solving the challenges of a 3D-IC design system.
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