Celsius Technical Brief - Rising to Meet the Thermal Challenge

Serial Link Engineering: A Novel Jitter/Noise Metric to Qualify Channel Components

Addressing the “Power-Aware” Challenges of Memory Interface Designs

System Simulation for RF Link Budget Analysis

5G Communications

Radar Systems

Virtuoso System Integration Whitepaper

Tech Clarity - Managing Work in Progress in Electrical Design

EDM creates the opportunity to help manage the overall electrical design process in addition to helping individual designers and managing design processes. Centrally aggregated WIP designs contain...

Power Integrity in System Design

As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.

Using Power Aware IBIS v5.0 Behavioral IO Models to Simulate Simultaneous Switching Noise

Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.

The Facts about the Input Impedance of Power and Ground Planes

Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.

Timing Skew Enabler Induced by Fiber Weave Effect

This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).

The Application of IBIS-AMI Model Cascaded Simulation for 10 Gigabit Repeater Serial Link Analysis

Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression

Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces

This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.

Power Integrity Conference Paper

Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation

Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.

IBIS-AMI for SerDes Modeling

Transistor-level accuracy can be obtained with high capacity channel simulation to predict BER using AMI modeling, even for the most complex EQ architectures

Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis

IBIS–AMI Modeling Recommendations Conference Presentation