Chip on Board (CoB) PCB Design Tips | Cadence
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HDI and Miniaturization
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Miniaturization of Satellite Technology Advancements
Explore how miniaturization of satellite technology is revolutionizing satellite development, with reduced costs and faster launches.
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How OrCAD X Enables Rigid Flex PCB Applications
Explore rigid flex PCB applications across multiple industries and their capabilities. Learn how OrCAD X tools enable these designs.
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L Network Impedance Matching With Two Components
L network impedance matching is a simple filter technique that requires minimal board space and components yet lacks some specificity.
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Memristor: The Component You Never Knew
The memristor was a “missing” component theorized in the 1960s and first manufactured in the 2000s, although the technology has not yet matured.
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Component Package Types: Selection Criteria
Component package types come in many shapes and sizes; a design can often support many variants, but it’s valuable to know when that’s the case.
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High-Density PCB Layout Tips for Designers
Designers must understand the benefits and concerns of working with high-density PCB layouts.
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MCM Packaging
Optimize your MCM packaging design for power efficiency, reliability, and streamlined functionality. Explore the latest advancements in MCM packaging.
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What is a Multi-Die Chip?
Learn about multi-die chip design and discover its benefits, applications, and the revolution it has brought to the semiconductor industry.
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CMOS Power Amplifier Design Tutorial
This CMOS power amplifier design tutorial investigates the major delineation between amplifier networks and their impact on performance.
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Dual In-line Package (DIP) IC: It Lives!
Dual in-line package (DIP) ICs have survived the transition to surface mount technology by remaining an accessible legacy format for prototyping.
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Integrated Resistors and Capacitors
Integrated resistors and capacitors are the less-heralded monolithic IC components, building off semiconductor device design for essential circuit roles.
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PCB Connector Pitch
PCB connector pitches indicate the gap between adjacent pins; smaller pitches are more space efficient but introduce additional DFM costs.
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An Introduction to IoT Development Boards
An in-depth guide on selecting the right IoT development board, with a discussion on capabilities and function.
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The Future of IoT Military Applications
A discussion on medical IoT PCB design fundamentals, including various medical IoT device types, design trends, and manufacturing tips.
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Bluetooth PCB Design Methodology and Tips
Learn more about Bluetooth operation, functionality, and applications as well as our design tips for creating Bluetooth PCBs.
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IoT Design Tips and Methodologies
Learn how to conduct IoT design for the next generation of devices. Low power, wireless, and mixed signal designs are covered in our brief article.
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Uncovering PCB Embedded Components
PCB embedded components can create additional space on your circuit board and help improve signal integrity within the design.
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NVIDIA and Cadence
NVIDIA leads the industry in developing visual computing technologies and is the inventor of the GPU, a high-performance processor that generates breathtaking...
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The Best PCB Via Size Guidelines for Your Design
For the best board layouts, you should follow a comprehensive set of PCB via size guidelines that adhere to standards and support your other design decisions.
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