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Electrostatic Discharge (ESD) Protection Design Guide

Key Takeaways

  • Electrostatic Discharge (ESD) is the momentary flow of electric current between two electrically charged objects.

  • ESD failures can be segmented into soft failures, latent defects, and catastrophic failures.

  • The ESD protection circuit diverts the ESD current flow by offering a low-impedance path.

Electrostatic Discharge (ESD) Protection Design Guide

ESD failures can be segmented into soft failures, latent defects, and catastrophic failures

Electrostatic discharge is a serious concern in any electronic circuit. Using an electrostatic discharge wrist strap, work mat, and workbench are basic anti-electrostatic discharge methods in electronic hardware development set-ups. However, following electrostatic discharge (ESD) protection design guidelines while transferring the circuit diagram to a PCB is important for protection against ESD. 

First of All, What Is Electrostatic Discharge?

Electrostatic Discharge, or ESD, is the momentary flow of electric current between two electrically charged objects. Electrostatic discharge can be due to contact, dielectric breakdown, or an electrical short.

ESD can be classified as:

Device-level ESD

Occurs in an assembled semiconductor in an ESD-controlled environment.

System-level ESD

Affects a finished electronic product.

Device-level ESD is more detrimental than system-level ESD. It is essential to protect electronic components from ESD, irrespective of whether they are mounted to a PCB or unmounted.

Many materials possess the property to conduct and accumulate electric charges. The electric charge stored in the material can be due to electrostatic induction or triboelectric charging. Whenever the object with stored charges comes into the vicinity of another electrically charged object, current flow between them due to the potential differences occurs. This flow continues until the charge balance is restored.

Degrees of ESD Failure

ESD-generated voltages and currents have fast rise times and high peak voltages. These currents and voltages are more than enough to completely blow off semiconductors and sensitive components. In fact, the degree of ESD failure ranges from subtle to harsh. ESD failures can be categorized as soft failures, latent defects, or catastrophic failures.

Soft Failure - Change in internal logic, data stream corruption. Temporary in nature.

Latent Defect - Components damaged by ESD. Functionality degrades over time, resulting in premature failure.

Catastrophic Failure - ESD completely damages the component.

ESD Protection in Electronic Circuits

The electronic industry is advancing rapidly, and we are seeing extensive use of microelectronic and semiconductor technology in electronic devices. For ICs and other electronic components, ESD is a common issue. If ESD protection is included in a circuit, the ESD protection device prevents the large current spike from damaging sensitive components. The ESD protection circuit diverts the ESD current flow by offering a low-impedance path. Let’s look at the ESD protection design guide for circuits next.

Electrostatic Discharge (ESD) Protection Design Guide

Electrostatic discharge protection can be acquired in PCBs by using ESD protection design guidelines during circuit design and by following PCB design rules. ESD protection design guidelines aim to prevent ESD events in terms of voltage as well as current. Some ESD protection circuits used in suppressing ESD in ICs are discussed in the table below.

ESD Protection Circuit

Protection Strategy

Series Resistors

Resistors connected in series to ICs increase the rise time of the signal and improve signal integrity and EMC.

Capacitors

Capacitors connected between an IC pin and ground limit the current and peak voltages.

Transient Voltage Suppressor (TVS) Diodes

TVS diodes can be bidirectional or unidirectional. Voltage damping is the protection strategy in TVS diodes.

Dual Schottky Diodes

Two Schottky diodes; one biased to the ground and the other to the voltage rail. The diode dumps the voltage to the voltage rail, not to the ground, and is effective in the presence of low-impedance power distribution networks.

ESD Protection Design Rules

Rule

Effect

Minimize the impedance between the protected IC pin and serge source

Minimizing the impedance ensures the ESD current flows through the ESD protection current.

Minimize the radiation on the PCB

Radiations can be minimized by placing the protection circuit closer to the IC pin.

Incorporate vias

Vias drain the current to the ground. Place the vias closer to the input.

Design ground with low impedance

Designing such a ground helps in dissipating ESD energy.

ESD Protection Circuits and Layout Design

Carefully following electrostatic discharge (ESD) protection design guidelines ensures your circuits are protected from ESD. To support your efforts, consider Cadence OrCAD PSpice simulation. OrCAD PSpice is the best platform to work with when designing ESD protection circuits.

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