Skip to main content

Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs

As flexible PCB fabrication technology has matured in response to demands for smaller, lighter products, new design challenges have emerged.

Flexible PCBs (flex/rigid-flex) make it possible to create a variety of products that require small form factors and light weight, such as wearable, mobile, military, and medical devices. As flexible PCB fabrication technology has matured in response to demands for smaller, lighter products, new design challenges have emerged. This paper discusses some of the key challenges to address and also introduces a new PCB design approach that enhances productivity through in-design inter-layer checks required to ensure correct-by-construction design. 

About the Author

Cadence PCB Solutions is a passionate writer and expert in the field of PCB design and electronic engineering. With years of experience in developing innovative solutions for complex circuit designs, Cadence PCB Solutions specializes in breaking down technical concepts into clear, actionable insights for engineers, hobbyists, and industry professionals alike.