Kirsch Mackey

Kirsch Mackey is an electrical engineer, educator, and content creator with over 15 years of experience spanning power systems, control systems, electrical systems, embedded programming, PCB design, power electronics, and high-speed digital systems. As founder of HaSofu and former adjunct professor, he developed the MESH method—a structured approach to high-speed PCB design that has helped students land roles at companies like Apple, Intel, Cisco, Garmin and Amazon in months rather than years. Drawing from industry experience at Intel and beyond, Kirsch bridges theory and practice through technical writing, courses, and hands-on workshops that make complex engineering concepts accessible and actionable.

3 days ago
Why SI and PI Must Be Solved Together During PCB Layout

Reference planes ensure signal & power integrity. Vias carry signal & power currents. Dielectrics impact both. Fixing one issue in isolation can break another.

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3 days ago
PCB Crosstalk Is a Layout Decision, Not a Post-Layout Issue

Crosstalk is predictable from geometry. Discover how spacing, length, and reference planes affect crosstalk, and how to measure near/far-end crosstalk during routing in Sigrity X Aurora.

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3 days ago
PCB Power Integrity Analysis: Why PDN Behavior Is a Geometry Problem

Your voltage regulator outputs clean power, but the IC has noise. The issue lies in the copper. Discover how plane spacing, cavity resonance, and via placement shape power delivery.

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3 days ago
Why Rule-Based Signal Integrity Checks Miss EMC Issues

Your PCB passes design rule checks but fails signal integrity at 8 Gbps. Discover three failure modes geometric rules miss and how electrical analysis prevents them pre-fabrication.

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20 days ago
The Hidden Cost of Via Choices in High-Speed Designs

Via stubs are a hidden threat to signal integrity. Learn the physics of quarter-wave resonance and how backdrilling or blind vias prevent destructive signal interference in your high-speed PCB design

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28 days ago
PCB Routing Topology Matters More Than Speed

Discover why PCB routing topology, like layer transitions, vias, and return path quality, matters more for Signal Integrity success than raw data speed.

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29 days ago
Why PDN Failures Rarely Come From 'Too Few Capacitors'

Learn the physics behind PDN failures and why high-frequency noise is controlled by mounting inductance, not just capacitance. Discover the key to lower loop impedance.

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about 2 months ago
The Physics of Resin Flow: Glass Weave Locking & Dielectric Behavior in HDI Laminations

Understand HDI PCB design by tackling resin flow, glass weave, and dielectric behavior. Prevent defects like voids, skew, and delamination in high-density stackups

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about 2 months ago
Architecting HDI for Ultra-Fine-Pitch Chiplets, AI Accelerators, and Fan-Out Packaging on Boards

Learn how to route 0.355 mm BGA pitches and design high density interconnect (HDI) PCBs for AI accelerators. Explore stackups, sub-3-mil routing, stacked microvias, and thermal management techniques.

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about 2 months ago
Return Path Integrity in HDI Designs: How Microvias Reshape High-Speed Current Flow

Learn how HDI PCBs and microvias reshape high-speed signal return paths. Discover critical stitching strategies for DDR5, PCIe Gen5/6, and USB4 to maintain signal integrity in dense BGAs.

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3 months ago
HDI Deconstructed

Explore HDI PCB design with our guide. Learn about microvia physics, materials, and reliability to optimize your high-density layouts. Download today.

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3 months ago
Why HDI Designs Fail in the Field: Advanced Root Causes Beyond Standard Microvia Cracking

Prevent HDI PCB failures with insights on resin starvation, copper pull-away, and CAF growth. Ensure long-term reliability using Cadence DFM solutions.

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3 months ago
Does HDI Improve Signal Integrity? The Real Electromagnetic Impact of Microvias

HDI promises better signal integrity, but does it deliver? Learn the real electromagnetic impact of microvias, via stubs, differential skew, and reference plane issues in high-speed PCB design.

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3 months ago
Electromagnetic Side Effects of HDI: Cavity Modes, Return-Path Fragmentation, and Plane Resonance Patterns

Explore electromagnetic challenges in HDI PCB design, like cavity modes and plane resonance, and learn how advanced EM tools help solve signal integrity and EMI issues. For PCB and hardware engineers.

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3 months ago
How Many Microvias Can You Safely Stack? A Deep Dive Into HDI Reliability Physics

Discover how stacking microvias impacts HDI density and reliability. Cadence explores thermal stress, CTE mismatch, and material choices to guide PCB engineers on safe stack heights for durable design

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4 months ago
Pre-Tapeout Confidence: In-Design Checks for Power Integrity in Allegro X

Analyze PCB Power Integrity with Allegro X: Check DC IR-Drop, Return Path Continuity, Isolation Spacing DRC. Avoid issues like ground necking, ensure certification, and pass testing on the first run.

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4 months ago
Layout the Hot Loop, Save the EMI: Practical Allegro X Constraints for SMPS

Minimize EMI in your SMPS PCB design by understanding the 'hot loop' in PCB layout. Learn the 3 essential rules and how to put them into Allegro X constraints to pass compliance the first time.

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4 months ago
Magnetics First: How Transformer Choices Make or Break Your Design

The transformer is the heart of every flyback design. Learn how primary inductance, turns ratio, and saturation current make or break your design's efficiency and size.

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4 months ago
A Flyback That Starts Clean: Modeling Startup & Burden in PSpice

Use PSpice transient simulation to learn flyback power supply startup. Learn to tune soft-start, control inrush current, and prevent output voltage overshoot before you build hardware.

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5 months ago
Thermal & EMI in Power Supply Design: The Physics Your Schematic Won't Show You

Addressing thermal and EMI issues early can prevent power supply design challenges. Learn practical guidelines, architecture strategies, and modern tools to design for compliance and avoid re-spins

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