The design methodology of high-density interconnect (HDI) technology allows for greater
wiring density, utilizing lines and spaces under 3 mils and microvias (holes less than 6 mils,
capture pads less than 13.8 mils) leading to greater miniaturization and reduced package
This section describes these key aspects of HDI requirements and the tool features
supporting them, such as microvias, DRCs for same net and net-net conditions, unused
inner-layer pad removal, rules for via tangency (vias touch but do not overlap) and stacking
(coincident location of adjacent layer vias), and dynamic filleting.