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An EDA perspective on advanced semiconductor packaging

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Overview of trends for foundry-based 2.5D-IC, 3D-IC, and FOWLP packaging, including the benefits of a modernized design flow.

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Read this Flipbook for an overview of trends for foundry-based 2.5D-IC, 3D-IC, and FOWLP packaging, including the benefits of a modernized design flow.

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