3D ICs with TSVs - Design Challenges and Requirements

October 18, 2018 Cadence PCB Solutions

3D integrated circuits (ICs) with through-silicon vias (TSVs) offer new levels of efficiency, power, performance, and form-factor advantages to the semiconductor industry. However, there’s still groundwork that must be laid to bring 3D ICs into the mainstream. Cadence offers a comprehensive solution to support the 3D IC revolution, including analog and digital implementation, packaging, and printed circuit board (PCB) design tools. With this solution, customers gain everything they need to cost-effectively design 3D ICs with TSVs.

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Cadence PCB solutions is a complete front to back design tool to enable fast and efficient product creation. Cadence enables users accurately shorten design cycles to hand off to manufacturing through modern, IPC-2581 industry standard.
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3D ICs with TSVs - Design Challenges and Requirements

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3D ICs with TSVs - Design Challenges and Requirements

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