3D ICs with TSVs - Design Challenges and Requirements
3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
3D integrated circuits (ICs) with through-silicon vias (TSVs) offer new levels of efficiency, power, performance, and form-factor advantages to the semiconductor industry. However, there’s still groundwork that must be laid to bring 3D ICs into the mainstream. Cadence offers a comprehensive solution to support the 3D IC revolution, including analog and digital implementation, packaging, and printed circuit board (PCB) design tools. With this solution, customers gain everything they need to cost-effectively design 3D ICs with TSVs.