Most Recent Flipbooks
This white paper highlights the features in Sigrity™ X SI/PI solutions for system-level SI/PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows.
3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.
Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market.
Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBISAMI models to emulate this real-world SerDes behavior.