Most Recent Flipbooks
3D ICs with TSVs - Design Challenges and Requirements
3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
How a Team-Based Approach to PCB Power Integrity Analysis Yields Better Results
This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.
Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market.
Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard
Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBISAMI models to emulate this real-world SerDes behavior.