Most Recent Flipbooks
3D ICs with TSVs - Design Challenges and Requirements
3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
Building Differentiated Products Through Shorter, More Predictable Design Cycles
How a Team-Based Approach to PCB Power Integrity Analysis Yields Better Results
This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.
Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market.
Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard