Sigrity Whitepapers

  • 3D ICs with TSVs - Design Challenges and Requirements

    3D ICs with TSVs - Design Challenges and Requirements

    3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.

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  • Building Differentiated Products Through Shorter, More Predictable Design Cycles

    Building Differentiated Products Through Shorter, More Predictable Design Cycles

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  • Power-Aware Analysis Solution

    Power-Aware Analysis Solution

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  • How a Team-Based Approach to PCB Power Integrity Analysis Yields Better Results

    How a Team-Based Approach to PCB Power Integrity Analysis Yields Better Results

    This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.

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  • Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages

    Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages

    Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market.

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  • Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard

    Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard

    Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBISAMI models to emulate this real-world SerDes behavior.

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