3D ICs with TSVs - Design Challenges and Requirements
3D ICs promise “more than Moore” integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
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Sigrity White Papers
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Building Differentiated Products Through Shorter, More Predictable Design Cycles
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Power-Aware Analysis Solution
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How a Team-Based Approach to PCB Power Integrity Analysis Yields Better Results
This paper examines a collaborative team-based approach that makes more efficient use of resources and provides more impact at critical points in the design process.
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Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market.
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Backchannel Modeling and Simulation Using Recent Enhancements to the IBIS Standard
Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBISAMI models to emulate this real-world SerDes behavior.
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