The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Gri...
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As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.
Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.
Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.
This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).
Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression
This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.
Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation
This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.
Transistor-level accuracy can be obtained with high capacity channel simulation to predict BER using AMI modeling, even for the most complex EQ architectures
The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis
The focus of this paper is the low frequency portion, including DC, of the spectrum for broadband Sparameters and guidelines to support successful SSO analysis for Chip-Package Board systems.
This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical printed circuit board (PCB) and package power distribution system (PDS)
AMI models using AMI_GetWave call are incompatible with purely statistical techniques
A practical approach for accurately modeling high-speed link structures is presented and named as the “cut and stitch” (C&S) methodology.
End users require ready access to accurate package models with increasingly complex packages, detailed PI consideration, and higher bandwidth
The effects of the distribution of power and ground vias in C4/BGA type of packages are studied.
Panel session addressing high-speed channel design challenges
Simulation / Measurement correlation requires accurate modeling of TX/RX/Channel
For upcoming industrial specification of very high speed signals, channel discontinuity and crosstalk become important.
Broadband methodology has the advantages of greater insight for the system-level influence of each domain as well as enabling resonance effects to be avoided at critical system frequencies.