Sigrity Conference Papers and Presentations

Featured Presentations and Papers from Sigrity Experts

  • Power Integrity in System Design

    Power Integrity in System Design

    As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.

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  • Using Power Aware IBIS v5.0 Behavioral IO Models to Simulate Simultaneous Switching Noise

    Using Power Aware IBIS v5.0 Behavioral IO Models to Simulate Simultaneous Switching Noise

    Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.

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  • The Facts about the Input Impedance of Power and Ground Planes

    The Facts about the Input Impedance of Power and Ground Planes

    Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.

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  • Timing Skew Enabler Induced by Fiber Weave Effect

    Timing Skew Enabler Induced by Fiber Weave Effect

    This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).

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  • The Application of IBIS-AMI Model Cascaded Simulation for 10 Gigabit Repeater Serial Link Analysis

    The Application of IBIS-AMI Model Cascaded Simulation for 10 Gigabit Repeater Serial Link Analysis

    Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression

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  • Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces

    Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces

    This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.

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  • Power Integrity Conference Paper

    Power Integrity Conference Paper

    Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation

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  • Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

    Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

    This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.

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  • IBIS-AMI for SerDes Modeling

    IBIS-AMI for SerDes Modeling

    Transistor-level accuracy can be obtained with high capacity channel simulation to predict BER using AMI modeling, even for the most complex EQ architectures

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  • Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

    Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

    The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis

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  • IBIS–AMI Modeling Recommendations Conference Presentation

    IBIS–AMI Modeling Recommendations Conference Presentation

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  • Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

    Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

    The focus of this paper is the low frequency portion, including DC, of the spectrum for broadband Sparameters and guidelines to support successful SSO analysis for Chip-Package Board systems.

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  • Effect of Power Noise on Multi-Gigabit Serial Links

    Effect of Power Noise on Multi-Gigabit Serial Links

    This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical printed circuit board (PCB) and package power distribution system (PDS)

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  • IBIS-AMI and Statistical Analysis

    IBIS-AMI and Statistical Analysis

    AMI models using AMI_GetWave call are incompatible with purely statistical techniques

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  • Efficient Methodology for Modeling Structure of High Speed Long Transmisison Lines

    Efficient Methodology for Modeling Structure of High Speed Long Transmisison Lines

    A practical approach for accurately modeling high-speed link structures is presented and named as the “cut and stitch” (C&S) methodology.

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  • Electrical Modeling and Model Representations for Package Interconnects and Power Delivery Networks Conference Presentation

    Electrical Modeling and Model Representations for Package Interconnects and Power Delivery Networks Conference Presentation

    End users require ready access to accurate package models with increasingly complex packages, detailed PI consideration, and higher bandwidth

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  • Effects of Power Ground Via Distribution on the Power Ground Performance of C4 BGA Packages

    Effects of Power Ground Via Distribution on the Power Ground Performance of C4 BGA Packages

    The effects of the distribution of power and ground vias in C4/BGA type of packages are studied.

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  • Panel Session TP-TU3 High-speed Channel Designs IBIS AMI Solution Conference Presentation

    Panel Session TP-TU3 High-speed Channel Designs IBIS AMI Solution Conference Presentation

    Panel session addressing high-speed channel design challenges

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  • Bridging the Measurement and Simulation Gap

    Bridging the Measurement and Simulation Gap

    Simulation / Measurement correlation requires accurate modeling of TX/RX/Channel

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  • Channel Based Methods for Signal Integrity Evaluation

    Channel Based Methods for Signal Integrity Evaluation

    For upcoming industrial specification of very high speed signals, channel discontinuity and crosstalk become important.

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