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Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages
Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

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Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card Conference Paper
Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card Conference Paper

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