Home » Sigrity Conference Papers and Presentations » IBIS-AMI for SerDes Modeling

× Share this Presentation

Facebook
Twitter
Email
LinkedIn

IBIS-AMI for SerDes Modeling

October 19, 2018 Cadence PCB Solutions

Share this Flipbook
Facebook
Twitter
Email
LinkedIn

IBIS-AMI is today's standard format for system-level SerDes modeling
A different type of modeling expertise is required to develop AMI models
Modeling the adaptive CTNLE functionality in the Analog Bits Rx is the most challenging AMI effort we have undertaken to date
Transistor-level accuracy can be obtained with high capacity channel simulation to predict BER using AMI modeling, even for the most complex EQ architectures

About the Author

Cadence PCB solutions is a complete front to back design tool to enable fast and efficient product creation. Cadence enables users accurately shorten design cycles to hand off to manufacturing through modern, IPC-2581 industry standard.
Follow on Linkedin Visit Website More Content by Cadence PCB Solutions

Previous Flipbook

Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for t...

Next Flipbook

Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Gri...

Most Recent Flipbooks

Power Integrity in System Design

As the transferring rate increase, Power Integrity becomes a more and more critical issue in modern high speed design.

Read Flipbook

Using Power Aware IBIS v5.0 Behavioral IO Models to Simulate Simultaneous Switching Noise

Typically simultaneous switching noise (SSN) transient simulations require significant CPU and RAM resources.

Read Flipbook

The Facts about the Input Impedance of Power and Ground Planes

Power and ground planes in a printed circuit board may connect to the power supply at several locations. Moreover, a number of decoupling capacitors may be connected to the power and ground planes.

Read Flipbook

Timing Skew Enabler Induced by Fiber Weave Effect

This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB).

Read Flipbook

The Application of IBIS-AMI Model Cascaded Simulation for 10 Gigabit Repeater Serial Link Analysis

Standard IBIS-AMI models can be used for modeling repeaters. No additional change in IBIS-AMI expression

Read Flipbook

Signal Integrity Methodology for Double-Digit Multi-Gigabit Interfaces

This paper will suggest methodologies for creating a “virtual prototype” of your serial link pre-design, and how to create the associated interconnect and SerDes models that go with it.

Read Flipbook

Power Integrity Conference Paper

Ultra-low impedance measurement and proper embedded technique should be applied to obtain the good correlation

Read Flipbook

Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.

Read Flipbook

Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis

Read Flipbook

IBIS–AMI Modeling Recommendations Conference Presentation

Read Flipbook

Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

The focus of this paper is the low frequency portion, including DC, of the spectrum for broadband Sparameters and guidelines to support successful SSO analysis for Chip-Package Board systems.

Read Flipbook

Effect of Power Noise on Multi-Gigabit Serial Links

This paper presents a proof-of-concept analysis that was performed to test the hypothesis that a typical printed circuit board (PCB) and package power distribution system (PDS)

Read Flipbook

IBIS-AMI and Statistical Analysis

AMI models using AMI_GetWave call are incompatible with purely statistical techniques

Read Flipbook

Efficient Methodology for Modeling Structure of High Speed Long Transmisison Lines

A practical approach for accurately modeling high-speed link structures is presented and named as the “cut and stitch” (C&S) methodology.

Read Flipbook

Electrical Modeling and Model Representations for Package Interconnects and Power Delivery Networks Conference Presentation

End users require ready access to accurate package models with increasingly complex packages, detailed PI consideration, and higher bandwidth

Read Flipbook

Effects of Power Ground Via Distribution on the Power Ground Performance of C4 BGA Packages

The effects of the distribution of power and ground vias in C4/BGA type of packages are studied.

Read Flipbook

Panel Session TP-TU3 High-speed Channel Designs IBIS AMI Solution Conference Presentation

Panel session addressing high-speed channel design challenges

Read Flipbook

Bridging the Measurement and Simulation Gap

Simulation / Measurement correlation requires accurate modeling of TX/RX/Channel

Read Flipbook

Channel Based Methods for Signal Integrity Evaluation

For upcoming industrial specification of very high speed signals, channel discontinuity and crosstalk become important.

Read Flipbook

Broadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High Speed IO Design

Broadband methodology has the advantages of greater insight for the system-level influence of each domain as well as enabling resonance effects to be avoided at critical system frequencies.

Read Flipbook

Return to Home