Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multi-layered packages are studied. Effects of area-array power and ground vias of different densities are evaluated by examining the input impedances of the package power supply. It is shown that, by properly selecting the density of shorting via arrays, package resonance can be removed from DC to multi-gigahertz frequency range.