This article discusses the problems of managing high-density vias in an HDI PCB design, as well as offering some potential management solutions.
This article describes what PCB test points are and how they are used, as well as how PCB design software generates them in a circuit board design.
This article discusses the problems with using multiple vias in a PCB design and how constraint usage for via management can help.
Conformal coating is a process that covers a PCB or component with a protective film barrier against mechanical and chemical damage.
Material Flow Analysis is a critical management tool for use in manufacturing.
Chemical mechanical processing, or CMP, goes by many names. It describes the process of modifying components by both mechanical and chemical means to create precise shapes.
Performing the right testing on your bare board PCBs can ensure that you don’t run into costly mistakes down the line, delaying your production timeline.
Reflow-induced failure is often overlooked until the turnaround time and costs for your boards increases. In this blog, we show you how to avoid these issues.
Fault Tree Analysis (FTA) and Failure Mode Effects Analysis (FMEA) provide different perspectives regarding risk in critical electronic systems.
Implementing lean manufacturing eliminates waste and increases value.
Designing analog ASICs should be performed with the same objectives of operational and structural reliability as for PCBA design, as we explain in this blog.
Is thermal paste needed for your board’s assembly can be determined by following the checklist we provide in this blog.
Laminated object manufacturing is a type of 3D printing and is a great way to rapidly and cheaply produce single-layer PCB prototypes.
When compared to flex PCBs or rigid-flex PCBs, rigid circuit boards offer many advantages.
Most PCB fabrication methods rely on the use of photoresist etching to ensure a standard of excellence is maintained.
Solid freeform fabrication allows design teams and manufacturers to offer unique designs.
Design for assembly process planning based on good DFA is one of the pillars of optimal PCBA development.
Having a clear understanding of the electronic manufacturing flow can help you make more sensible circuit design decisions to save you money and time.
Targeting lithographic processing during design, as discussed in this blog, can ensure that your PCBA development gets off to the best start.
In this blog, we compare FMECA vs fault tree analysis and answer the question of which one is better for your PCBA risk management. The answer may surprise you.
