Issue link: https://resources.pcb.cadence.com/i/1541046
24. Planning for Thermal Management: Heat Sinks, Vias, and Copper Pours Thermal problems are a leading cause of early board failures and system instability; overheated components suffer reduced reliability, performance loss, or catastrophic damage. Proper thermal management in layout prevents hot spots, enables high current or high power operation, and ensures the board passes safety and regulatory standards. Failing to plan for heat removal can turn a promising design into an unreliable, unbuildable product. When And Where To Apply Address thermal management at initial placement, during routing, and when assigning copper pours - especially for boards with high-current regulators, power FETs, LEDs, processors, or RF power devices. Cadence Celsius Thermal Solver - Accurate transient and steady-state analysis for electrical-thermal co-simulation