Issue link: https://resources.pcb.cadence.com/i/1541046
16. Reviewing and Optimizing Via Types, Sizes, and Counts Vias connect different layers of a PCB but introduce parasitic inductance, capacitance, and resistance. The type, size, and count of vias affect signal integrity, power delivery, manufacturability, and cost. Overusing vias increases complexity and decreases reliability, while under-sizing them can cause current bottlenecks or soldering problems. Choosing the correct via technology (through-hole, blind, buried, microvia, or via-in-pad) is crucial for high-speed, high- density, or high-current designs. When And Where To Apply Review and optimize via strategy during stackup planning, initial placement, and throughout routing, especially for high-speed, high-density, or high-current designs, as well as boards with BGAs, fine-pitch parts, or strict height constraints. Different types of PCB vias