Issue link: https://resources.pcb.cadence.com/i/1541046
21. Pouring Copper with Electrical Intent, Not Just for Fill Copper pours (large areas of copper tied to ground, power, or another net) can greatly improve EMC shielding, thermal management, and current-carrying capacity - but only if planned and connected correctly. Random or floating pours can become resonant antennas, couple noise, or create "dead copper" islands that do nothing for performance. Pouring copper "just to fill space" without electrical intent can cause more harm than good, especially in mixed- signal, high-speed, or power designs. When And Where To Apply Apply intentional copper pouring on every layer where additional ground, power, or shield is beneficial: high-speed, analog, RF, power, or thermal management regions. Always plan pours after placement but before final routing; review and update after major edits. Different power and ground copper pour areas in OrCAD X PCB layout