Embedded Component Design
Embedded Component Design
October 2019 23 Product Version 17.4-2019
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■ Default via connect padstack (#6): This padstack (single layer) serves as the 'connect
pin' on indirect attached embedded components. It can also be applied as a drawing level
property EMB_VIA_CONNECT_PADSTACK.
Embedded Component Constraints
Constraints specific to embedded components can be found in Setup – Constraints –
Modes – Design –Package.
■ Package Height to Adjacent layer: Verifies that the package height is less than the
thickness of the layer(s) that the cavity spans. The existing package height property is
used to store the height value. The thickness of successive layers is used when
validating a package place in a multi-layer cavity. For the case of Indirect attach, the
