Embedded Component Design
Embedded Component Design
October 2019 20 Product Version 17.4-2019
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Embedded Component Parameters
Direct Attach Method
Parameters associated with Embedded Component Design are available in the l Cross-
section Editor – Embedded Layer Setup tab.
Hovering over the parameter name or value field displays a brief description.
■ Package height buffer: (#1) Defines a clearance or buffer when calculating component
height violations in a substrate. For example, you may have concerns about placing a 10
mil tall component in a 12 mil substrate. The value entered in this field is essentially
added to the height of the components placed on the embedded layer.
■ Minimum cavity gap for merging (#2): Defines the minimum spacing between the edges
of a cavity before a merger takes place.
