Issue link: https://resources.pcb.cadence.com/i/1180280
Embedded Component Design Embedded Component Design October 2019 6 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. Terminology Direct Attached (soldered) The manufacturing technology where the components are soldered directly to an internal layer. One way to visualize this is to think of assembling a traditional PCB with the components on the external surface(s) and then laminating more layers on top of the components. Indirect Attach (glued) The manufacturing technology where the components are suspended in the dielectric material between the layers. The electrical connections are made by creating holes through the layers to the component pins and then plating those holes. Body Up The packaged part body is oriented toward the Top surface of the PCB. Fabricators may call this "Face Up" Body Down The packaged part body is oriented toward the Bottom surface of the PCB. Fabricators may call this "Face Down" Cavity (closed) The space around the embedded component in the dielectric between two etch layers. The XY dimensions of the cavity are driven by the size of the component and other manufacturing rules. In most applications, the cavity will be between two adjacent layers; however, multilayer cavities will be supported. Cavity (open) A blind hole in the substrate in which components are placed.This hole is open to one of the external substrate surfaces and may be several layers deep. The cavity will often have progressively smaller lengths and widths from the external surface to the depth of the cavity. IPC-7092 Standard for Embedded Device Printed Circuit Boards (In process) Hermes High density integration by Embedding chips for Reduced size Modules and Electronic Systems. EU-funded project designed to enhance the performance of PCBs by using embedded chips to integrate additional functions.