Embedded Component Design
Embedded Component Design
October 2019 22 Product Version 17.4-2019
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■ Cavity to Route Keepout Expansion:(#7) This parameter becomes relevant when a layer
is set to Protruding allowed. While the cavity has inherent route keepout behavior, it
may be desirable to extend the keepout area beyond the cavity profile.
Indirect Attach Method
The two remaining parameters 5 and 6 are editable when Indirect Attach is selected as the
attach method.
■ Via connect height (#5): Defines the height of the single layer via used to connect to the
component mounted in the substrate. Essentially, this value is the distance the
component sits off the foil. This value may be seen as negligible if ample space in the
vertical direction is available.
