Embedded Component Design
Embedded Component Design
October 2019 15 Product Version 17.4-2019
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Dual Layer Mounted (Separate Cores But Near Surface Layers)
Components are placed on two separate layers near the PCB surface. This reduces the
signal length to the component pins.
Single Layer Mounted (Dielectric Thickness Does Not Support Height of Components)
Components are placed on a single layer. Dielectric thickness is too thin to support
component height.
❑ Embedded Status is set to either Body up or Body Down"
