System-Driven PPA with Integrity 3D-IC Platform

A complete 3D planning system with integrated system-level analysis is the most reliable way to ensure chip-level PPA improvement. Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling System-driven PPA for multi-chiplet designs.

Leading electronics providers rely on Cadence products to optimize power, space, and energy needs for a wide variety of market applications. Unlock the potential of our innovative 3D-IC solutions tailored to your needs.