Designing PCBs today means using multiple tools to get the job done. The Allegro X Design Platform allows you to access all these tools in one unified design environment.
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A well-managed process flow is essential to successfully developing and managing PCB products and their lifecycles.
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A well-managed BOM can simplify your manufacturing process, reduce costs, and contribute to the overall efficiency of your production.
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Cadence and Autodesk will introduce their new and jointly developed ECAD-MCAD flow bridging Allegro X/OrCAD X PCB Editor and Autodesk Fusion.
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Learn design constraint methodologies in OrCAD X Platform for standard and high-speed designs
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From streamlining workflows to accelerating project timelines, we’ll showcase how the intuitive interfaces and simplified processes within Cadence’s new PCB layout solution reduce the learning curve..
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Accompany by 5G development, RF module design will meet more challenges in linearity, power, and heat necessary to be successful in the handset market.
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A complete 3D planning system with integrated system-level analysis is the most reliable way to ensure chip-level PPA improvement.
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Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.
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Michael Jackson, Corporate VP of Research and Development for Signoff Technology, explains the powerful RAID technology in the Tempus Signoff Solution to help address signoff complexities...
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Don Chan, VP of Research and Development for Foundry and 3D-IC, gives a breakdown of the key pieces of the Integrity 3D-IC platform targeted towards solving the challenges of a 3D-IC design system.
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Chin-Chi Teng, GM and SVP gives an overview of Cadence’s latest unified platform offering in the 3D-IC design and analysis space.
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Join our experts to understand the challenges introduced by 3D-ICs in system-level signal integrity (SI) signoff.
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inspectAR paired with Eastern Edge Robotics to demonstrate how much easier PCB assembly goes when using the inspectAR tool.
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The Hubble telescope, the Cassini-Huygens mission, and other exploratory spacecraft utilize high-voltage DC power supplies for everything from vidicon camera tubes and mass spectrometers to radar ...
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How to simulate your design in a virtual environment using SPICE models and different simulation profiles.
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If this analysis is in your future, whether as a manager or analyst, this talk by Charles Hymowitz, a WCCA SME, is for you.
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SI/PI Demos 3/18/2021
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Cadence Pulse Data Management & Demo March 11, 2021
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Fluke Q&A Session March 11, 2021
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