Introducing OrCAD X, Our Next-Generation PCB Layout Solution

From streamlining workflows to accelerating project timelines, we’ll showcase how the intuitive interfaces and simplified processes within Cadence’s new PCB layout solution reduce the learning curve..

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over 1 year ago

Efficient and Accurate RF/3DIC Model Extraction Solution with EMX (Chinese)

Accompany by 5G development, RF module design will meet more challenges in linearity, power, and heat necessary to be successful in the handset market.

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7 months ago

System-Driven PPA with Integrity 3D-IC Platform

A complete 3D planning system with integrated system-level analysis is the most reliable way to ensure chip-level PPA improvement.

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7 months ago

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.

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7 months ago

Signoff STA for Multi-Chiplet Design

Michael Jackson, Corporate VP of Research and Development for Signoff Technology, explains the powerful RAID technology in the Tempus Signoff Solution to help address signoff complexities...

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7 months ago

Delivering System-Driven PPA with a Unified Environment

Don Chan, VP of Research and Development for Foundry and 3D-IC, gives a breakdown of the key pieces of the Integrity 3D-IC platform targeted towards solving the challenges of a 3D-IC design system.

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7 months ago

A New Platform for 3D-IC Design and Analysis in Cadence’s 3D-IC Leadership

Chin-Chi Teng, GM and SVP gives an overview of Cadence’s latest unified platform offering in the 3D-IC design and analysis space.

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Integrated SI Analysis, Optimization, and Signoff of a 3D-IC System with Cadence Multi-Physics System Solvers

Join our experts to understand the challenges introduced by 3D-ICs in system-level signal integrity (SI) signoff.

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almost 2 years ago

inspectAR Case Study: PCB assembly

inspectAR paired with Eastern Edge Robotics to demonstrate how much easier PCB assembly goes when using the inspectAR tool.

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High-Voltage Circuit Design Guidelines and Materials

The Hubble telescope, the Cassini-Huygens mission, and other exploratory spacecraft utilize high-voltage DC power supplies for everything from vidicon camera tubes and mass spectrometers to radar ...

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