Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

October 6, 2023

Cadence’s Integrity 3D-IC is a comprehensive platform for 3D planning, implementation and system analysis enabling system-driven PPA for multi-chiplet designs.

Leading electronics providers rely on Cadence products to optimize power, space, and energy needs for a wide variety of market applications. Unlock the potential of our innovative 3D-IC solutions tailored to your needs.

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Design, Integrate, Analyze, and Manage with Allegro X On-Demand Webinar

Design, Manage, and Share Data with OrCAD X Cloud Workspaces On-Demand Webinar

Optimize Your Supply Chain Through Effective BOM Management On-Demand Webinar

Design in Harmony: Seamless ECAD and MCAD Collaboration On-Demand Webinar

Managing Constraints like a Pro in OrCAD X On-Demand Webinar

Introducing OrCAD X, Our Next-Generation PCB Layout Solution On-Demand Webinar

Efficient and Accurate RF/3DIC Model Extraction Solution with EMX (Chinese)

System-Driven PPA with Integrity 3D-IC Platform

Signoff STA for Multi-Chiplet Design

Delivering System-Driven PPA with a Unified Environment

A New Platform for 3D-IC Design and Analysis in Cadence’s 3D-IC Leadership

Integrated SI Analysis, Optimization, and Signoff of a 3D-IC System with Cadence Multi-Physics System Solvers

inspectAR Case Study: PCB assembly

High-Voltage Circuit Design Guidelines and Materials

Design a Buck-Boost Convertor

Webinar: Automotive Worst Case Circuit Analysis

SI/PI Demos 3/18/2021

Cadence Pulse Data Management & Demo 3.11.2021

Fluke Q&A Session 3/11/2021

SNC Cadence Demo for PCB design