Allegro PCB Editor User Guide: High Density Interconnect

October 28, 2019 Cadence PCB Solutions

The design methodology of high-density interconnect (HDI) technology allows for greater
wiring density, utilizing lines and spaces under 3 mils and microvias (holes less than 6 mils,
capture pads less than 13.8 mils) leading to greater miniaturization and reduced package
size.


This section describes these key aspects of HDI requirements and the tool features
supporting them, such as microvias, DRCs for same net and net-net conditions, unused
inner-layer pad removal, rules for via tangency (vias touch but do not overlap) and stacking
(coincident location of adjacent layer vias), and dynamic filleting.

About the Author

Cadence PCB solutions is a complete front to back design tool to enable fast and efficient product creation. Cadence enables users accurately shorten design cycles to hand off to manufacturing through modern, IPC-2581 industry standard.

Follow on Linkedin Visit Website More Content by Cadence PCB Solutions
Previous Flipbook
Embedded Component Design Best Practice
Embedded Component Design Best Practice

Increased market demands for smaller, lighter products, improved performance and higher speeds, it may beco...

Next Flipbook
Getting Started with Symphony Team Design
Getting Started with Symphony Team Design

This document introduces Symphony Team Design as a new product option,a concurrent design environment where...