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How to Set Up Microvias and Blind Buried Vias in Allegro X for HDI

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Discover the impact of via selection on HDI and high-speed PCB designs in this comprehensive video. Learn how through-hole, blind, buried, and laser-drilled microvias affect signal integrity, EMI behavior, return path continuity, and manufacturability. Understand how poorly chosen via structures can lead to impedance discontinuities, reflections, and routing challenges, especially in dense BGA fanouts.

Explore the benefits of blind and buried vias in reducing stub lengths, the role of microvias in enabling dense escape routing, and how via choices influence signal containment and stackup planning in Allegro X. Perfect for engineers navigating the complexities of HDI designs and high-speed PCB layouts.