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HDI BGA Fanout Techniques Via-in-Pad, Stacked Microvias, and Ground Stitching in Allegro X

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In this video, we explore proven Ball Grid Array (BGA) escape routing strategies used in real-world hardware designs. Key techniques demonstrated in Allegro X include:

  • Top-layer fanout for efficient signal breakout
  • Via-in-pad techniques to save space and improve routing density
  • Layer transitions to deeper routing layers for optimal signal flow

Learn how to overcome the challenges of tightly spaced BGA pads and ensure your HDI PCB designs meet performance and manufacturability requirements.