Are Your HDI Vias Carrying Current You Think They Are

Designing an HDI PCB for AI accelerator applications? Signal integrity alone isn't enough. If your microvias can't deliver the power, your design is set up to fail. In this video, we walk through a two-step enhanced power delivery verification workflow that goes beyond DRC and design rules. First, current density analysis uses a field solver is used to map current distribution across all layers, through every microvia, helping you identify thermal hotspots before they lead to board failures. Next, IR drop analysis helps verify that every chip in your design receives voltage within its minimum operating range, that way you can correct voltage drop by adjusting via counts and copper geometry. As microvias in high-density interconnect designs carry more current through less surface area than traditional vias, simulation-based power validation becomes non-negotiable for modern AI hardware.