Thermal Analysis

Thermal resistance is a significant parameter controlling the heat flow from the component junction to the heat sink in electronic packages.

A 4-pin PWM header works to balance noise and PC temperature—read on to learn more about the benefits of 4-pin PWM headers and what you need to design a fan controller.

This article is about PCB effective thermal conductivity, factors that affect its efficiency and accuracy, and what to consider during thermal modelling design.

This article will discuss how temperature hysteresis works and some design considerations for building a temperature hysteresis controller.

MPPT vs. PWM is a common comparison when designing solar charge controllers. See this article for which to use as well as some design tips.

This article examines the difference between a VRM and a MOSFET, how to calculate MOSFET temperature, and how to regulate VRM MOSFET temperature.

Accelerated life testing thermal cycling quantifies the life characteristics, failures, and defects that occur when products are employed in the field.

In electronic circuit systems, heat transfer negatively impacts performance. The investigation of heat transfer using simulation is helpful to design effective thermal management.

Designing reliable electronic products is contingent upon implementing PCB heat dissipation techniques to help avoid early component failure.

If you’re not taking a proactive approach to VRM cooling, the power delivered to the CPU and GPU will be compromised and affect their performance.

Thermal hysteresis creates permanent changes in the output voltage from a precision reference voltage circuit.

PWM and DC fans allow you to control the speed of your computer’s cooling fan, enabling CPU cooling and case ventilation.

Impedance vs resistance? Is one more important for laying out your board? The answer is clearly explained in this blog.

Even in the steady-state, heat still moves between hot and cold regions. Here’s how you can use a field solver for steady-state heat transfer analysis.

When you need to learn more about your heat management strategy, it helps to match CFD analysis data to standard models.

The use of thermal relief in circuit design is critical to the design process and it affects performance, functionality, and lifecycle.

Is thermal paste needed for your board’s assembly can be determined by following the checklist we provide in this blog.

Heat sink CFD simulations give the aerodynamic profile of a system, which helps the designers address thermal problems through heat sink geometry optimization.