Thermal Analysis

  • Designing Your PCB for Thermal Reliability

    Designing Your PCB for Thermal Reliability

    Do you know how to ensure thermal reliability in your PCB? Here’s what you need to know when designing for different applications.

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  • CFD Modeling and Simulation in Electronics Design

    CFD Modeling and Simulation in Electronics Design

    CFD modeling and simulation ranges from the chip level to the room level. Here’s what you can learn about your design with CFD analysis.

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  • Determining Heat Sink CFD Simulations and What to Examine

    Determining Heat Sink CFD Simulations and What to Examine

    What can you figure out with a heat sink CFD simulation? Here’s why you need one of these computational tools.

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  • Nonlinear Multiphysics Modeling for Electronics and Thermal Management

    Nonlinear Multiphysics Modeling for Electronics and Thermal Management

    The real world is nonlinear. Here’s why you need a nonlinear multiphysics modeling simulation tool for advanced electronics.

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  • Design Guidelines for Shallow Trench Isolation Thermal Stress Minimization

    Design Guidelines for Shallow Trench Isolation Thermal Stress Minimization

    Shallow trench isolation thermal stress may be unavoidable; however, its effects can be mitigated as described in this blog.

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  • Routing Challenges of High-Temperature Designs

    Routing Challenges of High-Temperature Designs

    The routing challenges of high-temperature designs call for advanced design skills and tools. Here are some ideas that will help you with your next PCB design.

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  • Common Types of FEA Analysis for PCB Development

    Common Types of FEA Analysis for PCB Development

    Knowing and applying the types of FEA analysis discussed in this blog will improve your design’s manufacturability and reliability.

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  • Thermomechanical Analysis for Your Thermally Cycled PCB Designs

    Thermomechanical Analysis for Your Thermally Cycled PCB Designs

    Thermomechanical Analysis for Your Thermally Cycled PCB Designs | Advanced PCB Design Blog | Cadence

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  • Solder Joint Reliability Simulation and Temperature Rise

    Solder Joint Reliability Simulation and Temperature Rise

    With a solder joint reliability simulation, you can determine whether your board will operate within thermal cycling limits.

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  • Using a Thermal FEA Solver for Heat Management in Your PCB

    Using a Thermal FEA Solver for Heat Management in Your PCB

    Use thermal FEA simulator for your heat management problems to keep your PCB running at acceptable temperature.

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  • Using a Multiphysics Heat Finite Element Solver

    Using a Multiphysics Heat Finite Element Solver

    If thermal management is a problem in your PCB, you can map heat flow and steady state temperature in your board with a heat finite element solver.

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  • PCB Design for Laser Flash Analysis in Manufacturing

    PCB Design for Laser Flash Analysis in Manufacturing

    By understanding Laser Flash Analysis in manufacturing you can design for optimized board build. In this blog, we show you how.

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  • Differential Thermal Analysis and PCB Substrate Glass Transitions

    Differential Thermal Analysis and PCB Substrate Glass Transitions

    Need to measure the CTE value for your PCB substrate? Try using differential thermal analysis.

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  • Thermal Noise Floor and Increasing Signal-to-Noise Ratio

    Thermal Noise Floor and Increasing Signal-to-Noise Ratio

    If noise is a problem in your circuits, you’ll never reduce noise below the thermal noise floor.

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  • Managing Variable and Constant Temperature Circuits

    Managing Variable and Constant Temperature Circuits

    Variable and constant temperature circuits require attention to AC load and overall electronic functionality needs.

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  • Junction Temperature vs. Ambient Temperature: Transistor Temperature Operability

    Junction Temperature vs. Ambient Temperature: Transistor Temperature Operability

    The junction temperature is dependent on ambient temperature, and thus, it affects the design and overall device’s applicational uses.

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  • Thermo-Electric Cooling, A Counter-Measure to High Current Density on a PCB

    Thermo-Electric Cooling, A Counter-Measure to High Current Density on a PCB

    Thermo-electric cooling, or TEC, has been seen as a breakthrough in small refrigerators that do not consume a whole lot of power.

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  • Design for Low PCB Thermal Resistance

    Design for Low PCB Thermal Resistance

    Here are some ways you can design your board with low PCB thermal resistance as part of a larger heat management strategy.

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  • Fr4 Maximum Temperature and Thermal Dissipation

    Fr4 Maximum Temperature and Thermal Dissipation

    Fr4 maximum temperature will determine impedance and other signal integrity standards to take into account for your circuit designs.

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  • Thermal Pads vs Thermal Paste: How Best to Beat the Heat

    Thermal Pads vs Thermal Paste: How Best to Beat the Heat

    To conduct heat from the hot components on your PCB to their heat sinks, you need to choose between thermal pads vs thermal paste. Here is some help on that.

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