Thermal Analysis

CFD modeling and simulation ranges from the chip level to the room level. Here’s what you can learn about your design with CFD analysis.

What can you figure out with a heat sink CFD simulation? Here’s why you need one of these computational tools.

The real world is nonlinear. Here’s why you need a nonlinear multiphysics modeling simulation tool for advanced electronics.

Shallow trench isolation thermal stress may be unavoidable; however, its effects can be mitigated as described in this blog.

The routing challenges of high-temperature designs call for advanced design skills and tools. Here are some ideas that will help you with your next PCB design.

Knowing and applying the types of FEA analysis discussed in this blog will improve your design’s manufacturability and reliability.

Thermomechanical Analysis for Your Thermally Cycled PCB Designs | Advanced PCB Design Blog | Cadence

With a solder joint reliability simulation, you can determine whether your board will operate within thermal cycling limits.

Use thermal FEA simulator for your heat management problems to keep your PCB running at acceptable temperature.

If thermal management is a problem in your PCB, you can map heat flow and steady state temperature in your board with a heat finite element solver.

By understanding Laser Flash Analysis in manufacturing you can design for optimized board build. In this blog, we show you how.

Need to measure the CTE value for your PCB substrate? Try using differential thermal analysis.

If noise is a problem in your circuits, you’ll never reduce noise below the thermal noise floor.

Variable and constant temperature circuits require attention to AC load and overall electronic functionality needs.

The junction temperature is dependent on ambient temperature, and thus, it affects the design and overall device’s applicational uses.

Thermo-electric cooling, or TEC, has been seen as a breakthrough in small refrigerators that do not consume a whole lot of power.

Here are some ways you can design your board with low PCB thermal resistance as part of a larger heat management strategy.

Fr4 maximum temperature will determine impedance and other signal integrity standards to take into account for your circuit designs.

To conduct heat from the hot components on your PCB to their heat sinks, you need to choose between thermal pads vs thermal paste. Here is some help on that.