The Cadence® Sigrity™ PowerDC™ environment provides fast and accurate DC analysis for IC packages and PCBs along with thermal analysis that also supports electrical and thermal co-simulation. Targeting both pre- and post-layout applications, the Sigrity PowerDC approach enables you to quickly identify IR drop, current density, and thermal issues that are among the leading field failure risks. Powerful features, including sense line location optimization and simplified design-rule checker (DRC) confirmation, work in concert with the fastest available simulation to support design improvements without excess cost and schedule impacts.
