Issue link: https://resources.pcb.cadence.com/i/1541046
37. Verifying All Pad, Hole, and Footprint Sizes for Manufacturing How To Implement 1. Use IPC-compliant land patterns or manufacturer recommendations: f Reference IPC-7351 for SMD, and IPC-2221/2222 for through-hole standards. f Check the component datasheet for recommended pad size, shape, pitch, and tolerance. 2. Check and confirm all footprint parameters in CAD: f Measure pad width, length, and spacing for SMD packages; verify via the "measure" tool against the datasheet. f For through-hole: Check finished hole diameter (must accommodate lead + tolerance + plating), annular ring (minimum per fab), and pad-to-hole concentricity. f For BGAs, QFNs, LGA, or CSPs, verify ball/pad pitch, mask opening, and any via-in-pad requirements. 3. Confirm solder mask and paste mask openings: f Ensure mask openings are larger than the pad by the fab's recommended expansion (often 2-4 mils). f Verify that paste mask reductions are applied where required (e.g., large thermal pads or fine-pitch parts). 4. Cross-check against your fab's capability tables: f Confirm minimum/maximum pad sizes, drill diameters, finished hole tolerance, and mask features match the manufacturer's published limits. f For microvias, confirm the supported stackup and via fill/ cap requirements. 5. Review with the assembly house and perform DFM checks: f Use automated DFM (Design for Manufacturability) checks to spot undersized, oversized, or out-of-spec pads and holes. f Send land patterns for review/approval by your assembly/ CM, especially for new or custom parts. 6. Validate with 3D and real components: f Use the 3D viewer to check fit, height, and spatial relationships. f If possible, test-fit a physical sample on a bare board or 3D-printed model for tight-tolerance or critical connectors. Common Pitfalls, Their Impact, and How to Avoid Them Common Pitfalls How to Avoid it Trusting auto-gen- erated or third-party libraries blindly They often have errors in pad size or spacing – Verify pad sizes, footprints, and clearances against component datasheets. Forgetting to adjust for finished hole size vs. drill size Plating can shrink hole diameter by 1-2 mils – Account for plating shrinkage in your drill tables. Overlooking mask/ paste requirements for fine-pitch parts Can cause bridging, insufficient solder, or open joints – Review for each footprint. Neglecting to check fab or CM capabilities Your design may pass in CAD but fail in production – Confirm layer stackup, via sizes, spacing, and assembly limits with your manufac- turer.