Issue link: https://resources.pcb.cadence.com/i/1541046
11. Grouping by Functional Blocks and Signal Flow How To Implement 1. Analyze the schematic for blocks and flows: f Review the schematic and identify all major functional blocks: power input/conversion, processor, memory, analog front-end, RF, user interface, and output drivers. f Sketch a high-level "floorplan" of block placement reflecting logical or signal flow, e.g., from power entry, through regulation, to digital logic, to outputs. 2. Cluster components by function: f Place all passives, filters, and support parts (e.g., decoupling caps, pull-ups, load resistors, bias networks) as close as possible to their associated IC or block. f Keep analog and digital sections physically separated; likewise, isolate power circuits and RF modules from sensitive analog. f Position connectors and I/O for direct routing to their relevant functional block. 3. Arrange blocks in order of signal or power path: f Place the power input near the voltage regulator, regulators near loads, sensors near analog front-ends, analog outputs close to their connector or output stage, etc. f For digital data flow (e.g., MCU -> memory -> display), align blocks to allow the shortest, most direct trace paths and logical review. 4. Maintain block boundaries and routing "streets": f Leave open routing channels (corridors) between blocks for critical buses, high-speed signals, or major power planes. f Use silkscreen or a mechanical layer to annotate block boundaries for both assembly and troubleshooting. 5. Check for noise and domain isolation: f Keep high-noise sources (switching regulators, motor drivers) and high-frequency digital blocks separated from low-noise analog, sensor, or RF circuits. f Ensure analog and digital grounds meet at a single point (star or hybrid ground) or as recommended by IC vendor guidelines. 6. Iterate and review: f After initial grouping, step back and visualize the signal/ power flow: is each path as short and direct as possible? Are any blocks forced to "cross over" noisy regions? f Review with your team, and adjust as needed for test access, EMI, mechanical constraints, and upgrade paths. Common Pitfalls, Their Impact, and How to Avoid Them Common Pitfall How to Avoid it Scattering support passives far from their block Increasing trace lengths and vulnerability to noise – Place decoupling and bypass capacitors as close as possible to their corre- sponding IC and on the same layer. Forgetting about domain crossings Analog, RF, and digital circuits can't simply be "close" without an isolation strategy – Partition your board into separate sections. Obstructing key routing paths Overcrowding blocks can block bus routing, force unnecessary vias, or make probing difficult – Prioritize routing critical nets first, such as high-speed clocks, differential pairs, and RF signals.