Issue link: https://resources.pcb.cadence.com/i/1180280
Embedded Component Design Embedded Component Design October 2019 34 Product Version 17.4-2019 © 1999-2019 All Rights Reserved. The physical representation of a Cavity subclass is a filled dynamic shape. The boundary of the shape is coincident with the route keep in. There is a one shape limitation per Cavity subclass. Cavities that are created (either by placing an embedded component or by manual editing) are represented as voids in the dynamic shape. Automatically generated cavities that overlap or are within the minimum cavity spacing value are automatically merged into one void. Manually-edited cavities are not automatically merged. The behavior is similar to that of dynamic etch shapes. No islands are permitted; any islands generated by voiding is automatically removed. The package symbol definition supports a fixed subclass called Embedded Geometry / Cavity Outline. When the package symbol is placed on an embedded layer, the geometry from the Cavity Outline subclass is copied to the corresponding layer of the Cavity class, thereby generating a void in the dynamic shape. If no geometry exists on the Embedded Geometry / Cavity Outline subclass, then the Embedded Geometry / Place_Bound geometry is used to