Cadence PCB Best Practices

Embedded Component Design

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© 1991–2019 Cadence Design Systems, Inc. All rights reserved. Portions © Apache Software Foundation, Sun Microsystems, Free Software Foundation, Inc., Regents of the University of California, Massachusetts Institute of Technology, University of Florida. Used by permission. Printed in the United States of America. Printed in the United States of America. Cadence Design Systems, Inc., 555 River Oaks Parkway, San Jose, CA 95134, USA Allegro PCB Editor contains technology licensed from, and copyrighted by: Apache Software Foundation, 1901 Munsey Drive Forest Hill, MD 21050, USA © 2000-2005, Apache Software Foundation. Sun Microsystems, 4150 Network Circle, Santa Clara, CA 95054 USA © 1994-2007, Sun Microsystems, Inc. Free Software Foundation, 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA © 1989, 1991, Free Software Foundation, Inc. Regents of the University of California, Sun Microsystems, Inc., Scriptics Corporation, © 2001, Regents of the University of California. Daniel Stenberg, © 1996 - 2006, Daniel Stenberg. UMFPACK © 2005, Timothy A. Davis, University of Florida, (davis@cise.ulf.edu). Ken Martin, Will Schroeder, Bill Lorensen © 1993-2002, Ken Martin, Will Schroeder, Bill Lorensen. Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts, USA © 2003, the Board of Trustees of Massachusetts Institute of Technology. vtkQt, © 2000-2005, Matthias Koenig. All rights reserved. Trademarks: Trademarks and service marks of Cadence Design Systems, Inc. (Cadence) contained in this document are attributed to Cadence with the appropriate symbol. For queries regarding Cadence's trademarks, contact the corporate legal department at the address shown above or call 1-800-862-4522. Open SystemC, Open SystemC Initiative, OSCI, SystemC, and SystemC Initiative are trademarks or registered trademarks of Open SystemC Initiative, Inc. in the United States and other countries and are used with permission. All other trademarks are the property of their respective holders. Restricted Print Permission: This publication is protected by copyright and any unauthorized use of this publication may violate copyright, trademark, and other laws. Except as specified in this permission statement, this publication may not be copied, reproduced, modified, published, uploaded, posted, transmitted, or distributed in any way, without prior written permission from Cadence. This statement grants you permission to print one (1) hard copy of this publication subject to the following conditions: 1. The publication may be used solely for personal, informational, and noncommercial purposes; 2. The publication may not be modified in any way; 3. Any copy of the publication or portion thereof must include all original copyright, trademark, and other proprietary notices and this permission statement; and 4. Cadence reserves the right to revoke this authorization at any time, and any such use shall be discontinued immediately upon written notice from Cadence. Disclaimer: Information in this publication is subject to change without notice and does not represent a commitment on the part of Cadence. The information contained herein is the proprietary and confidential information of Cadence or its licensors, and is supplied subject to, and may be used only by Cadence's customer in accordance with, a written agreement between Cadence and its customer. Except as may be explicitly set forth in such agreement, Cadence does not make, and expressly disclaims, any representations or warranties as to the completeness, accuracy or usefulness of the information contained in this document. Cadence does not warrant that use of such information will not infringe any third party rights, nor does Cadence assume any liability for damages or costs of any kind that may result from use of such information. Restricted Rights: Use, duplication, or disclosure by the Government is subject to restrictions as set forth in FAR52.227-14 and DFAR252.227-7013 et seq. or its successor.

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