Home

Featured resources on all things PCB

  • Introduction to PCI Express: Design Challenges for Computing

    Introduction to PCI Express: Design Challenges for Computing

    PCI express, or PCIe, has a slew of challenges for designers looking to make smooth connections in their motherboard and computer circuits.

    Read Article
  • PCB Design Tools to Promote Engineering Team Collaboration

    PCB Design Tools to Promote Engineering Team Collaboration

    For designers to stay ahead of the technology development race, they will need concurrent PCB design tools in order to leverage engineering team collaboration.

    Read Article
  • What are the Cost Considerations for 4-layer, 6-layer, and 8-layer PCB Designs?

    What are the Cost Considerations for 4-layer, 6-layer, and 8-layer PCB Designs?

    When comparing PCB cost by layer, be sure to address all of the needs of the application before making any design decisions.

    Read Article
  • ×

    Sign Up for Our Newsletter and Receive a Free Ebook

    Opt-in to future emails and I understand I can unsubscribe at any time.
    I agree to the Terms of Use*
    *required
    Terms of Use
    Thank you! Your ebook has been emailed!
    Error - something went wrong!
  • RF Design: The Wave of the Future

    RF Design: The Wave of the Future

    Your car keys wirelessly unlock your car when you get near it. Your phone connects to Air Pods while you listen to Spotify at the gym or stream the latest hit TV show.

    Read Flipbook
  • Start My Free Trial

    Start Now
  • What is Hardware Software Co-design and How Can it Benefit You or Your Business?

    What is Hardware Software Co-design and How Can it Benefit You or Your Business?

    Hardware-Software Co-design is poised to bring about a new level of performance, functionality, and design accuracy.

    Read Article
  • ×

    What Industry Are You In?

    Industry
    Opt-in to future emails and I understand I can unsubscribe at any time.
    Agree to Terms of Use*
    *required
    View terms of use
    Thank you!
    Error - something went wrong!
  • Land Grid Array or LGA Manufacturing: Packaging and Substrate Concerns

    Land Grid Array or LGA Manufacturing: Packaging and Substrate Concerns

    When considering LGA manufacturing, you’ll want to be sure to account for the components you’re using for any kind of consumer electronics.

    Read Article
  • Digital Logic Circuit Design Simulation Software

    Digital Logic Circuit Design Simulation Software

    The use of simulation software affords you the ability to create a virtual exact replication of components and circuit designs without actual expenditures being incurred.

    Read Article
  • Decision Feedback Equalization in High Speed Data Links

    Decision Feedback Equalization in High Speed Data Links

    Decision feedback equalization is critical for extracting data in high speed serial links with multi-level signal modulation schemes.

    Read Article
  • HDI Routing Challenges and Tips

    HDI Routing Challenges and Tips

    HDI routing requires understanding of tight component layout, EMI interactivity, and current flow distribution

    Read Article
  •  What is Via Current and How to Measure its Effects?

    What is Via Current and How to Measure its Effects?

    Vias and their current carrying capacity affects the overall PCB functionality and design.

    Read Article
  • DVI Routing Tips in PCB Design

    DVI Routing Tips in PCB Design

    DVI routing involves understandings of strong component placement in PCB layout, as well as balancing EMI throughout the electronic device.

    Read Article
  • PCB Design Considerations for Vibration Fatigue

    PCB Design Considerations for Vibration Fatigue

    Circuit board failures can often be attributed to vibration fatigue. Here is some data that will help you to design for reliability on your next PCB design.

    Read Article
  • Standard 8 Layer PCB Stackup Techniques and Challenges

    Standard 8 Layer PCB Stackup Techniques and Challenges

    When working through an 8 layer PCB stackup, it is best to take into consideration manufacturing and production needs as well as system placement, if any.

    Read Article
  • Impedance Matching in Interconnects with Inductive Circuit Loads

    Impedance Matching in Interconnects with Inductive Circuit Loads

    Loads that behave like inductive circuits can be difficult to impedance match. Here’s what you need to know about inductive circuit behavior and termination.

    Read Article
  • Introduction to Non-parametric Analysis for Electronics

    Introduction to Non-parametric Analysis for Electronics

    Non-parametric analysis is best suited for the analyzing of functionality and performance when the aim is to quantify a comparison.

    Read Article
  • FLEXing Like a PCB Expert

    FLEXing Like a PCB Expert

    Flex PCB design has many advantages. Along with those benefits come new design challenges that weren’t present in “standard” 2D PCBs.

    Read Flipbook
  • How to Do a Life Cycle Cost Analysis of an Electronic Device

    How to Do a Life Cycle Cost Analysis of an Electronic Device

    A life cycle cost analysis can mitigate expenditures and assist in the forecast of asset longevity and performance.

    Read Article
  • Lost in Transmission: Solving Common Issues in High-Speed Design

    Lost in Transmission: Solving Common Issues in High-Speed Design

    Creating a printed circuit board with high-speed design functionality is no small feat. The more complex a PCB design becomes, the higher the chances are of running into high-speed PCB design issues.

    Read Flipbook
  • Component Reliability Considerations with Circuit Simulation

    Component Reliability Considerations with Circuit Simulation

    A headache for PCB designers is having to locate and correct component reliability problems on a finished board. Here’s some ideas to help before you design.

    Read Article
  • PDN: Gives Your Board Life

    PDN: Gives Your Board Life

    Power Integrity analysis is more important than ever. Product trends continue to demand reduced form factor, while requiring even more power to support our always-on, always-connected lives.

    Read Flipbook
  • loading
    Loading More...