Save Time and Minimize Errors by Automating Co-Design and Co-Analysis of Chips, Boards, and Packages
This technology provides a seamless and automated design flow between IC, package, and PCB design that can accelerate the overalldesign process and minimize errors.
Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence® Virtuoso® System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro® and Sigrity™ packaging and PCB design domains. This technology provides a seamless and automated design flow between IC, package, and PCB design that can accelerate the overall design process and minimize errors.